「Senior EE Engineer (TPE)」的相似工作

⚫4E2 應徵方式：請點選公司介紹欄下方「顯示全部V」的說明。由於點擊主動「應徵」信件數量繁多，本公司承辦人員不易一一審閱。敬請使用專函 email 或郵寄信件應徵，讓承辦人員優先發現您的應徵信。請不要使用「點擊主動應徵」方式，以免有滄海遺珠之憾。 ⚫4E2 電子工程師工作內容： 1. 硬體：熟電源供應器，無線遙控產品。 2. 軟體：單晶片組合語言程式設計、防盜控制系統設計。 3. 韌體：曾寫過有關汽車防盜器或家用、商用防盜器大程式者佳。家用、車用防盜器產品應用。

1. 技術可行性分析，硬體線路及高速訊號設計。 2. 熟練PCBA power budget填寫，具備和DC power開機時序以及接口定義。 3. 熟練GPIO table填寫，具備和BIOS/EC溝通協作能力。 4. 熟悉PCBA 開發流程，BOM以及工廠製造文件如deviation，生產加工注意事項產出。 5. 審查SCH/ PCB Layout，依據客戶要求產出SCH checklist/Layout checklist。 6. 樣品測試/偵錯/修正。 7. 數據資料分析與報告。 8. 供應商聯繫，利用廠商資源進行design review 以及Issue debug。 9. 優化設計及降低成本能力。 10. 產品/元件失效分析與風險評估。 11. 可直接面對客戶或消費者端技術支援。 12. 電路分析，失效分析與除錯。 13. 孰悉PCBA design and test spec。 14. 良好的溝通協調能力，熟悉和BIOS/DC/PM/Layout/SE/EMC/SPM合作模式。

1. 領導專案團隊，完成電腦主機板的硬體設計開發，包含：原理圖設計、layout檢查、調試及相關文檔報告 2. 運用前沿技術，優化產品、服務、流程或工具 3. 深入研究專業技術，降低設計成本，產出專利與創新產品 4. 跨部門溝通合作與協調協作 5. 服務客戶並滿足客戶產品設計規格和品質需求 6. 提出開發流程改善建議，撰寫專業技術開發檔與報告內容

1. 規劃及執行硬體電路設計、系統整合、除錯與測試 2. 與團隊合作、鑑定、確認及解決相關研發的問題。 3. 提供電子方面的技術協助和解決方法。 4. 產品工程規格書寫。 5. 協助業務單位瞭解客戶需求。 6. 售後市場不良解析 7. 新技術研讀與創意開發 8. 其他主管交辦事項

1. 電路設計與線路圖開發 • 負責筆記型電腦與桌上型電腦主機板的電路設計，包含電源管理、訊號處理與介面模組。 • 使用EDA工具繪製並優化線路圖，確保訊號完整性與電源穩定性。 • 選擇並整合關鍵硬體元件，滿足產品效能與成本需求。 2. 硬體驗證與問題診斷 • 制定測試計畫並執行硬體功能驗證，確保設計符合規格與穩定性要求。 • 使用示波器、多用電表等工具進行電路除錯，分析並解決硬體異常問題。 • 優化設計以提升效能、降低功耗或解決熱管理挑戰。 3. 跨部門協作與技術支援 • 與BIOS/UEFI團隊合作，確保硬體與固件的無縫整合與相容性。 • 支援製造部門進行原型製作與量產轉換，解決生產過程中的技術問題。 • 提供客戶（OEM/ODM廠商）與內部團隊硬體設計相關的技術諮詢。

1.x86 & ARM mainboard design and system integration in IPC. 2.Designing and integrating hardware circuit. 3.Reviewing layout placement and checking board file. 4.Performing hardware test & debug on motherboard. 5.Performing system integration. 6.Working with PM and Sales to come out the product spec.

Job Description : 1. Schematic Designing 2. IC Solution Survey 3. Evolution Board Test 4. BOM Checking 5. Power Circuit Design Experience 6. EMI Test Experience 7. Familiar with VSG / VSA / VNA Test 8. RF Circuit Design Experience is better 9. RF Front-End Module Design Experience is better 10. Communication/Radar Background is better P.S. 1. 公司注重工作態度、學習態度、團隊合作 2. 五年以上工作經驗 3. 儲備硬體R&D主管 4. 專案分紅

1. 電子紙產品硬體設計與研發 (eReader/eNote) 2. 電子紙產品硬體設計與研發 (eSign/eSignage) 3. 新型態電子紙產品設計研發與規劃

1.產品之硬體設計，進行各階段問題分析，能獨立作業，並將其順利導入量產。 2.信號量測，功能測試與協助處理客戶反應之問題。 3.維護舊機種的各項修正。 ※薪資與職稱會依學經歷背景及相關工作經驗敘薪。

1. 電腦主機板線路設計、驗證及除錯。 2. 平板電腦、醫療電腦、車載電腦、工業電腦等應用研發。 3. 可獨立承接專案設計與協助檢查電路設計 4. 有主機板電源設計經驗者尤佳 5. PCB Layout 檢查 6. 處理產品零件替換料 。

【本職缺優先審核至高通官網投遞人選】請至高通官網上傳英文履歷表： 【Talents who apply job through Qualcomm Career Website will be reviewed and considered as top priority】 https://careers.qualcomm.com/careers/job/446702219543 【Job Description】 As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Application Engineer, you will provide technical expertise of hardware through trainings, product demonstrations, and the design, debug, test, and quality support of customer products. Qualcomm Hardware Application Engineers collaborate with cross-functional teams to assess the potential application of company products that meet and exceed customer needs. 【Additional Job Description】 - Digital system HW schematic and layout review for Laptop/Tablet - Strong understanding of high-speed digital interfaces such as USB, PCIE, DP, MIPI and etc - dGPU design experience is preferred - Support device power optimization and measurement. - Memory optimization support for DDR and eMMC/UFS. - System bring-up support in both power and digital system. - EC debug and charging fine tuning. - Application note and technical memo publishing. - Training provides. 【Skills/Experience】 - 2 years above in laptop/tablet industrial. - Experience in ARM based HW system and peripheral design. - Familiar with EC power management and battery charging. - Familiarity with layout tool like Allegro and Power PCB. - Solid knowledge and experience with digital system design. - Mobile industry experience, laptop OEMs, tablet production line. - Digital circuit, software drivers, and power management, embedded system boot flow are plus. 【Additional Skills】 - Good communication in both Chinese and English - The candidate is a good team builder with excellent people skills and used to operating in networked and virtual team environments. - Natural self-starter, self-motivated, independent, and resourceful problem solver. - Outstanding oral and written communication skills capable of presenting persuasively to all levels of the organization in an articulate and succinct manner. Active listening ability. - High intention in engineering and technical analysis. - The candidate is a mature person able to establish relationships to build credibility and influence at all levels of the organization in appropriate manners. - He/She is a team player and has an easy-to-work-with attitude.

Responsibilities include: 1. Lead team or act the staff role to develop shelf controller module inside OCP ORV3 21 " or 19" rack to monitor and control Power and BBU shelf for data center. 2. Familiar with ARM Cortex A7 BMC AST2600/2620 chip or Intel x86 CPU design. 3. Experiences for Linux embedded board bring up and debugging. 4. Good knowledge of protocol for IPMI, I2C, UART, SPI RS485, Redfish. 5. Lead for schematic circuit design and PCB layout review. 6. Familiar with, CanBus, Modbus communication, ethernet, PoE, eMMC, security feature 7. Familiar with DC/DC converter circuit design, buck-bust converter and flyback . 8. Signal integrity and power integrity measurement and verification. 9. Support RFI and RFQ activities and provide technical proposal. 10. Good communication in English, both oral and written. Capable to talk and discuss technical topic in front of customer. Requirements: • BS in Electrical Engineering or related field. Prefer MS degree or above • 8+ years of related experience in consumer PC/Industrial PC, laptop, RISC and networking related products; for Team Lead prefer least 3 years for people manager role. • Demonstrated strong leadership for product design in multiple-disciplinary environment. • Competence in customer focus innovation and able to drive technology growth • Good communication skills, people management, self-motivation and the ability to successfully deal with ambiguity are a must. • Cadence Orcad capture or Mentor PADS capture. The information we collect: We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.

1. You will drive the team to design systems that are as elegantly simple and integrated as possible to enable our reliability and cost goals 2. Technical development in your own area of expertise, in an area of: power electronics, motor control, battery management, or battery development 3. Communicate cross-functionally to ensure clarity of priorities, status, and risks 4. Full lifecycle electrical engineering experience: concept, simulation, design, bring-up, validation 5. Passion for hardware development, and an interest in working quickly, efficiently, and hands-on 6. Ability to work in a fast paced, autonomously driven, and demanding start-up atmosphere

我們正在尋找一位硬體測試工程師，負責電路板的設計、製作與測試，並支援物聯網設備的開發、測試與改裝。此角色將參與新硬體的開發流程，從設計階段到測試驗證，確保設備的穩定性與可靠性。 主要職責： * 電路板設計與製作：獨立完成電路板的設計、佈線（PCB Layout）、打樣、焊接與測試。 * 物聯網感測器與韌體測試：使用公司開發的晶片與韌體，進行感測器與設備測試，並提供調整建議。 * 硬體設備改裝與優化：依據需求，改裝與優化物聯網設備，提高其性能與安全性。 * 研發設備組裝與實驗：參與研發設備的組裝、測試與實驗，確保功能達標並記錄測試結果。 * 客製化與出貨檢料：協助物聯網設備的客製化開發，並在出貨前進行硬體檢查與驗證。 * 資料串聯與驗證：驗證感測器資料的正確性，並確保數據能夠順利串聯至雲端服務，提升系統整合效率。 職位要求： * 具備電子電路設計能力，能獨立完成 PCB 設計、Layout、打樣與測試。 * 熟悉電子元件特性與電路分析，能進行電路板焊接與除錯。 * 熟悉示波器、萬用電表等電子測試儀器，能進行測試與故障排除。 * 了解嵌入式系統與物聯網技術，能與韌體工程師協作進行測試與優化。 * 具備良好的問題解決能力與動手實作能力，能獨立處理新硬體設計與測試挑戰。 * 有 AI MCU 或其他物聯網設備開發經驗者優先。 如果你對物聯網硬體開發充滿熱情，並且具備獨立設計與測試電路板的能力，歡迎加入我們的研發團隊，一起打造創新的物聯網設備！

1. Circuit Design(OrCAD) 2. Layout Review(Allegro) 3. HW Validation and Trouble Shooting 4. BOM Maintenance and P/N Application 5. New Technology Study and Introduction 6. Design Proposal Integration 7. Schedule Control 8. Cross-sectional Collaboration

We are seeking a Senior Hardware Engineer with a passion for hardware design and engineering. This role requires close collaboration with validation engineers, ODM hardware design engineers, and multidisciplinary teams to deliver state-of-the-art AI server solutions. The ideal candidate will take ownership of hardware design and planning for AI server systems, working closely with ODM hardware design engineers to review schematics and layouts, validate board and system circuits and applications, and resolve technical issues across teams. • Responsibilities:  Design and plan hardware systems for AI server solutions, including motherboards, thermal & cooling solution and system architecture.  Work closely with sales and customers to support integrations required for business development, i.e. contribute to customer RFPs and partner SOWs.  Engage in technologies and products research to propose new offerings and Proof of Concepts.  Perform AI server schematics and layout design review, debugging and testing  Verify design power and signal integrity requirements, functional behavior, and performance targets.  Lead the design and validation of thermal design and cooling solutions to ensure optimal system performance and reliability.  Conduct thermal simulations and analyze thermal performance under various operating conditions.  Collaborate with validation testing engineers to identify and resolve any design maturity and quality related issues.  Create technical documentation including product specifications, layout instructions, test procedures, etc.  Transfer products to contract manufacturer with clear documentation, and help technical support to resolve customer issues.  Stay updated with industry trends and advancements to ensure innovative designs.

1.消費性電子硬件工程 2.硬件問題協助分析

1. 主要為Wifi/BT無線通訊系統硬體設計 2. 電子電路研發與整合 3. 熟悉具備下列背景為佳，無經驗但有熱忱亦可 - 高頻儀器量測 - 射頻與天線相關經驗 - 產品設計與量產經驗

 Project platform HW system design integration  EE Schematic design  PCB layout design and review  RFQ/PRD research and feedback  Component survey and technology study  Bom creation and maintain  EE circuit/system design developing , validation and debugging.

| 簡介 法商伊索曼為一家國際醫療器材公司，主要從事醫療器械的研發、設計、生產和行銷，項目涵蓋神經外科、骨科、腫瘤科、消化科及心血管治療等臨床所需的醫療器材。目前，我們急需新血的夥伴加入我們的團隊。工作環境自由，並提供學習醫療器材領域知識的機會。如果您對上述項目有興趣且充滿動力，誠摯歡迎您的加入，讓我們一同開發優秀的醫療器材產品。 | 職位缺說明 1. 負責醫療器材研發項目的電子工程相關工作，包括電路設計、電路板Layout和信號 處理等。 2. 參與醫療器材設計的整個生命週期，從需求分析、電路設計、原型製作到驗證和量 產。 3. 依據醫療器材法規和標準進行設計和開發工作，確保符合相關規範和要求。 4. 協調與其他團隊成員與委外供應商管理合作，實現項目目標並保證品質。 職位要求： 1. 學歷：電子工程、電機工程、生物醫學工程或相關專業學位。 2. 專業知識：具備電子工程知識，熟悉微控制器和電子零件規格，有信號處理 和類比/數字電路設計經驗。 3. 相關經驗：有醫療器材研發或相關領域的工作經驗尤佳。 4. 技能：熟練掌握電子電路設計工具，具備軟體開發和編程能力。 5. 團隊合作：良好的溝通能力和團隊合作精神，能夠與多學科團隊協作。

1. EE系統電路架構規劃及設計 2. 電子元件評估與選用 3. 與Layout工程師、軟韌體工程師/結構工程師溝通、協調並完成電路、佈局設計及確認 4. 驗證手機及平板產品硬體功能性與穩定性 5. 撰寫測試計劃書內容及測試報告 6. 驗證流程問題釐清與建議提出 7. BOM建立與量產技術轉移 8. 協助部門主管交派事項