「Senior EE Engineer (TPE)」的相似工作

1. DRAM/SSD/Flash與高速卡片/影像產品/可攜式多媒體與硬碟儲存設備等新產品之開發。 2. 負責產品解決方案:電路設計， Layout規劃， 產品Debug與驗證。 3. 市場電子零組件特性測試與選用，供應廠商調查與分析。 4. 產品開發各項工作支援：如機構設計之檢討，產品文件之協同製作。 5. 市場競品規格資料蒐集及產品分析

Responsibilities include: 1. Lead team or act the staff role to develop shelf controller module inside OCP ORV3 21 " or 19" rack to monitor and control Power and BBU shelf for data center. 2. Familiar with ARM Cortex A7 BMC AST2600/2620 chip or Intel x86 CPU design. 3. Experiences for Linux embedded board bring up and debugging. 4. Good knowledge of protocol for IPMI, I2C, UART, SPI RS485, Redfish. 5. Lead for schematic circuit design and PCB layout review. 6. Familiar with, CanBus, Modbus communication, ethernet, PoE, eMMC, security feature 7. Familiar with DC/DC converter circuit design, buck-bust converter and flyback . 8. Signal integrity and power integrity measurement and verification. 9. Support RFI and RFQ activities and provide technical proposal. 10. Good communication in English, both oral and written. Capable to talk and discuss technical topic in front of customer. Requirements: • BS in Electrical Engineering or related field. Prefer MS degree or above • 8+ years of related experience in consumer PC/Industrial PC, laptop, RISC and networking related products; for Team Lead prefer least 3 years for people manager role. • Demonstrated strong leadership for product design in multiple-disciplinary environment. • Competence in customer focus innovation and able to drive technology growth • Good communication skills, people management, self-motivation and the ability to successfully deal with ambiguity are a must. • Cadence Orcad capture or Mentor PADS capture. The information we collect: We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.

1. 電路設計與線路圖開發 • 負責筆記型電腦與桌上型電腦主機板的電路設計，包含電源管理、訊號處理與介面模組。 • 使用EDA工具繪製並優化線路圖，確保訊號完整性與電源穩定性。 • 選擇並整合關鍵硬體元件，滿足產品效能與成本需求。 2. 硬體驗證與問題診斷 • 制定測試計畫並執行硬體功能驗證，確保設計符合規格與穩定性要求。 • 使用示波器、多用電表等工具進行電路除錯，分析並解決硬體異常問題。 • 優化設計以提升效能、降低功耗或解決熱管理挑戰。 3. 跨部門協作與技術支援 • 與BIOS/UEFI團隊合作，確保硬體與固件的無縫整合與相容性。 • 支援製造部門進行原型製作與量產轉換，解決生產過程中的技術問題。 • 提供客戶（OEM/ODM廠商）與內部團隊硬體設計相關的技術諮詢。

Company Description Axiado is an AI-enhanced security processor company redefining the control and management of every digital system. The company was founded in 2017, and currently has 100+ employees. At Axiado, developing great technology takes more than talent: it takes amazing people who understand collaboration, respect each other, and go the extra mile to achieve exceptional results. It takes people who have the passion and desire to disrupt the status quo, deliver innovation, and change the world. If you have this type of passion, we invite you to apply for this job. Job Description In this highly visible role as Senior Hardware Engineer, you will 1. Drive product from concept to production 2. Be actively involved in system design on embedded computing system products 3. Create hardware specs and develop test plans 4. Capture Schematics using Orcad 5. Work with Layout, Mechanical and SI engineers to complete the designs 6. Bring up systems and execute engineering validation in the lab 7. Interact with cross-functional teams for technical discussions. 8. Direct customer interaction and involvement. 9. Address challenging problems and issues 10. Ability to work on multiple tasks concurrently. 11. Engage and drive HW builds and procurement Qualifications 1. Seeking at least 6+ years of Hardware engineering experience. 2. Hands on board design knowledge, schematic capture, PCB layout instructions, signal integrity. 3. Familiarity with design tools including Cadence Orcad and Allegro 4. Thorough knowledge of basic interfaces such as I2C, SMBUS, SPI, UART, USB. 5. Knowledge of high speed interfaces such as PCIe, DDR, Display and Network interfaces 6. Knowledge of DC-DC step down converter design. 7. Experience with x86/Arm Servers and their subsystems 8. Hands on experience with lab equipment and bring up and design validation on products. 9. Excellency in debug of issues, analytical skills. 10. Excellent verbal and written communications skills. 11. Added knowledge of familiarity with Linux and scripting languages

Molex possesses a rich heritage in the optical industry. We provide the highest performing and field-proven wavelength management solutions from components, modules to integrated line-cards. Continuous innovation in passive component function integration, miniaturization, and manufacturing automation, cutting edge WSS and amplification technology and comprehensive optical, mechanical, electrical and software design capabilities enable us to serve the needs of high-density, high-bandwidth, and flexible optical networks of telecom, datacom, hyperscale datacenter, artificial intelligence, and supercomputing. In New Taipei, Taiwan, we serve global clients in telecom and datacom industries in providing next generation optical modules to support 5G Networks. We are looking for a Senior Electrical Design Engineer. We are building a new capability to accelerate our leading edge optical networking capabilities. We are looking for a Senior Engineer that will design, review, and improve a variety of optical equipment, including OTDR, OCM, OSC and other electronic products for 5G and other advanced optical networking systems and data communications networks. Responsibilities: • Develop, review, release, and support advanced optical modules and sub-systems such as OTDR, OSC, OCM, etc. • Work with product marketing and engineering team consisting of optical, hardware, mechanical, software, and process engineers to enable high performance, cost effective, and robust products, and repeatable and efficient manufacturing • Ensure successful transition from architecture to new product introduction and to volume production • Drive and recommend innovative solutions to ensure product meets customer performance, cost, schedule, and other requirements • Select components, generate schematic design, create PCB layout instructions, and closely work with FPGA, software, mechanical, thermal, optical, process and other teams to optimize the design • Perform circuit simulation for high speed signals using HFSS, ADS, or similar • Complete board bring-up, debug and validate performance of electronic systems; conduct experiments to characterize components and subsystems • Generate documentation of the design and results of the experiments and testing • Help develop DVT, manufacturing, assembly, diagnostic, test, qualification plans and other documents. Provide technical guidance to resolve manufacturing issues • Resolve customer technical issues. Work with FAE, QA, and other technical-support teams • Work with global teams for new product designs • Perform other duties as assigned by management Requirements: • Bachelors degree in Electrical Engineering • At least 8 years electrical engineering experience in Telecom, Datacom industry or related fields • Proficient in designing high speed boards • High speed digital transmission and signal integrity knowledge • Proficient with electronic design and simulation tools, such as OrCAD with CIS, Allegro, HFSS What will put you ahead • Masters of Electrical Engineering • Experience EDFA and Raman optical amplifiers • Experience in designing and resolving ESD, EMI, Immunity and other compliance and safety related items • Proficient in analog electronics: TIA, PD, filters, ADC, DAC, analog PLLs, etc.

1. 領導專案團隊，完成電腦主機板的硬體設計開發，包含：原理圖設計、layout檢查、調試及相關文檔報告 2. 運用前沿技術，優化產品、服務、流程或工具 3. 深入研究專業技術，降低設計成本，產出專利與創新產品 4. 跨部門溝通合作與協調協作 5. 服務客戶並滿足客戶產品設計規格和品質需求 6. 提出開發流程改善建議，撰寫專業技術開發檔與報告內容

1. Precision Analog Circuit Design(OP Amp applications, sensor applications) 2. Digital Circuit Design(Logic IC, Interface, High speed Bus Design) 3. AC/DC,DC/DC power circuit design 4. PCB Layout review 5. Validation and calibration process design 6. Testing system development 7. FPGA or MCU development skill would be a plus

1. 領導並發展高效率的軟體研發團隊，達成公司產品開發目標。 2. 制定並執行軟體開發策略，確保專案按時程、預算內完成。 3. 提升團隊技術能力，引領技術創新，保持產品競爭力。 4. 負責團隊成員的招募、培訓、績效考核與發展，建立積極、合作、高效的團隊文化。 5. 參與產品規劃，制定軟體開發計畫，監督專案進度，確保專案順利進行。 6. 評估並選擇合適的開發工具、技術與框架，指導團隊成員提升技術能力，引領團隊技術創新。 7. 建立完善的軟體測試流程，確保產品品質，推動程式碼審查、單元測試等品質保證活動。 8. 與產品、業務等部門密切合作，確保產品符合市場需求，積極溝通協調，解決跨部門合作問題。

【電子(EE)高級研發工程師】 1. 醫療器材開發前設計概念發想及技術可行性評估 -新技術評估 -key part survey 2. 醫療器材系統規劃，風險分析，設計，開發，驗證及文件撰寫 -Schematic design, Layout review, BOM create, Design Verification Test (DVT) -Documentation for EE deign and system quality 3. 協助產線解決量產中製造及製程中的問題 - 產測治具開發 - Trouble shooting guide 4. 客訴檢討 -不良品分析 【電子(EE)研發工程師-歡迎新鮮人投遞】 1. 繪製電路 2. Layout檢查 3. 新料號建立, BOM表建立, 4. 工程樣品備料, 5. 小量組裝, 6. 工程樣焊接 7. 執行工程樣品測試

Key Responsibilities: • Product definition & specification about electronics engineering. 制定產品及和電子相關的規格。 • Review and verify EE design and product testing. 電子設計和產品測試的審查和驗證。 • Work out the solutions with cross-function teams when there are any EE issues during the development cycles. 在開發週期階段，遇到電子問題會跨部門一起找出解決方案。 • Work for production test plan, and hardware change processes according to the PRD change. 根據產品規格書的變更來調整產線測試計畫和硬體設計。 • On site for trial build assembly/process in the factory, verify the product quality and output yield rate. 參與工廠試產並驗證生產品質及產出良率。 • EE BOM & cost reviewing. EE BOM和成本的審核。 Preferred Education/Experience: • Bachelor's degree or higher degree in electronic engineering. 電子工程學士或者更高的學位。 • Requiring technical expertise in electronical engineering area, 2+ years on computer peripheral devices or other consumer products design experience. 需要具備2年以上在電腦周邊或其他消費性產品的電子專長。 • Experienced in one of layout tools, e.g. OrCAD, PADS, Allegro or Altium designer… etc. 使用過電路板繪製軟體，像是OrCAD, PADS, Allegro or Altium designer…等。 • Experienced in some of electronic measuring instruments, e.g. Oscilloscope, spectrum analyzer, logic analyzer, network analyzer or audio precision system. 使用過電子量測設備的經驗，像是示波器、頻譜分析儀、邏輯分析儀、網路分析儀或音頻精密系統。 • Team player with outspoken, open-minded and cross-regions/countries communication/cooperation. 具備團隊精神，直言不諱，思想開放，能與其跨地區和國家的同事溝通合作。 • Need to travel to China or Southeast Asia. Each business trip is less than one week. 需要前往中國或東南亞出差，但每次出差時間少於一周。

Job Description : 1. Schematic Designing 2. IC Solution Survey 3. Evolution Board Test 4. BOM Checking 5. Power Circuit Design Experience 6. EMI Test Experience 7. Familiar with VSG / VSA / VNA Test 8. RF Circuit Design Experience is better 9. RF Front-End Module Design Experience is better 10. Communication/Radar Background is better P.S. 1. 公司注重工作態度、學習態度、團隊合作 2. 五年以上工作經驗 3. 儲備硬體R&D主管 4. 專案分紅

1. Circuit Design(OrCAD) 2. Layout Review(Allegro) 3. HW Validation and Trouble Shooting 4. BOM Maintenance and P/N Application 5. New Technology Study and Introduction 6. Design Proposal Integration 7. Schedule Control 8. Cross-sectional Collaboration

1. ICC2, Innvous for IO/IP planning, placement, bump &RDL. 2. physical verification . Be familiar with package flow is better. 3. Knowledge about process, ESD protect principle to do fullchip ESD design. 4. Perform power analysis with PTPX and IR/EM analysis with Redhawk or voltus. 5. Develop Perl/TCL/Shell scripts for flow and procedure automation. 6. Work proactively with EDA engineers and tool suppliers to debug tool functionality and bugs. 7. Design optimization of 2.5D/3D advanced silicon/package technology features to enable strong product differentiation. 8. 2.5D/3D -IC Test Chips validation of 2.5D/3D -IC technology platforms and design methodology.

強力徵求對電腦硬體研發充滿熱情的夥伴們! 艾訊嵌入式系統提供完整軟硬件，以及量身制訂的工業物聯網(IPC/IoT)與人工智能(AI)解決方案組合，提供客戶開發高密度集成以及高效能的電腦。產品的應用廣泛，有佈署在重工業與智慧工廠的Edge Server，做為資料收集管理與大數據分析；也有Edge Computer搭配Intel/Nvdia等大廠合作的AI加速卡， 應用於edge端做為聲音/影像辨識以及即時的資料分析與處理；採用X86架構具備低耗能的IoT Gateway，適用於連結各種IoT Devices並且專責不同通訊協定的轉換， 達成將Devices所有的訊息傳送至Server或Cloud。採用SoC + EC + MCU架構應用於Retail, Medical, smart City等產品線，甚至有為創客開發的類樹梅派X86主機板，應用在無人機、智慧推車、智能家電等產品。 這個職位著重於IPC/IoT不同應用場域的新產品開發與設計，此工作需要工程師的專業以及邏輯能力，並嚴謹地找出問題真因與解決問題。 期待您加入團隊，讓我們發揮眾智，一起打造一流的IPC/IoT產品，同時也成為世界級的研發團隊。 工作內容主要包含: 1.電子產品硬體系統之設計與評估 2.產品硬體訊號量測與功能驗証 3.技術問題處理與排除 4.新技術研發與創新 ＊彈性工作時間，薪優福利佳，並備有新店/中和線交通車＊

【公司簡介】： 費米是一家在台灣深耕多年，具有良好口碑的智慧家庭公司，我們致力於開發和銷售實用且有品質產品。我們同時具備自主產品開發能力。　 為了提高核心競爭力與長期發展考量，我們正在尋找一位具有豐富經驗和卓越能力的技術產品經理加入我們的團隊。此職位將作為產品技術的把關者，與工廠間的重要橋梁，確保產品從設計到生產，從量產到用應用的落地順利進行，需具備軟硬體整合的經驗。 【工作內容】: 1.對公司產品制定並執行進階測試計劃，協同工程師驗證測試。 2.作為內部諮詢窗口，解決產品綜合問題。 3.作為供應商溝通窗口，探討技術問題。 4.代工廠評估與合作確認：篩選、實地考察、樣品檢驗。 5.設計與生產管理：設計評審、生產計劃、小批量試產。 6.品質與認證管理：品質控制，確保產品有符合法規認證要求。 7.軟硬體整合：協調硬體設計與軟體開發團隊，確保產品整合順利。 8.技術轉移與安裝：實施內部技術與客服的教育訓練。 【必備條件/職能】： 1.相關專案管理經驗，特別是與代工廠合作的經驗。 2.優秀的溝通和協調能力，能夠有效管理內外部關係。 3.熟悉生產流程和品質控制標準。 4.熟悉硬體零組件與其特性，具備硬體開發相關工作經驗。 5.軟硬體整合經驗，能夠理解並協調硬體設計與軟體開發的需求。 6.具備軟硬體測試經驗，能夠指導和監督產品測試流程。 7.具備軟韌體概念，熟悉軟硬體搭配的規格配置。 8.確保產品符合目標市場當地認證，如NCC、BSMI、TELEC、PSE等。

01. 具有專案獨立作業能力、自主當責，能自主規劃工作並推動專案進行，且帶來成果 02. 熟悉電子電路、IC選用、產品系統硬體規劃、設計、產品功能驗證、除錯 03. 熟悉電子電路設計軟體，如Orcad 04. 熟悉電子電路佈局軟體review，如PADS, Allegro 05. 研發試產備料及BOM表整理 06. 進行PCB樣品製作流程之發包打件及PCB樣品驗證 07. 配合處理零件承認之相關事宜，熟悉零件搜尋、規格驗證者 08. 監督、評核外包PCB板廠、SMT打件廠的品質 09. 協助FAE解決客戶問題

1. You will drive the team to design systems that are as elegantly simple and integrated as possible to enable our reliability and cost goals 2. Technical development in your own area of expertise, in an area of: power electronics, motor control, battery management, or battery development 3. Communicate cross-functionally to ensure clarity of priorities, status, and risks 4. Full lifecycle electrical engineering experience: concept, simulation, design, bring-up, validation 5. Passion for hardware development, and an interest in working quickly, efficiently, and hands-on 6. Ability to work in a fast paced, autonomously driven, and demanding start-up atmosphere

1. 技術可行性分析，硬體線路及高速訊號設計。 2. 熟練PCBA power budget填寫，具備和DC power開機時序以及接口定義。 3. 熟練GPIO table填寫，具備和BIOS/EC溝通協作能力。 4. 熟悉PCBA 開發流程，BOM以及工廠製造文件如deviation，生產加工注意事項產出。 5. 審查SCH/ PCB Layout，依據客戶要求產出SCH checklist/Layout checklist。 6. 樣品測試/偵錯/修正。 7. 數據資料分析與報告。 8. 供應商聯繫，利用廠商資源進行design review 以及Issue debug。 9. 優化設計及降低成本能力。 10. 產品/元件失效分析與風險評估。 11. 可直接面對客戶或消費者端技術支援。 12. 電路分析，失效分析與除錯。 13. 孰悉PCBA design and test spec。 14. 良好的溝通協調能力，熟悉和BIOS/DC/PM/Layout/SE/EMC/SPM合作模式。

⚫ Design server relative power solution and review PCB layout. ⚫ Work with function team like EE, SI, mechanical and thermal engineers to ensure optimize hardware solutions. ⚫ Experience on AMD and Intel VPU VRs design and testing - Sr. DC engineer ⚫ Come out test plans to secure function of power solution. ⚫ Work with suppliers and vendors to select components and solutions. ⚫ Support 2nd source solutions and validation. ⚫ Work closely with firmware teams to integrate and troubleshoot management feature. ⚫ Support manufacturing teams during the production phase.

艾訊TIOT提供各種移動式載具、運具、運輸營運站體等場域完整的系統解決方案。我們除了提供強固型高效能的BOX PC、Panel PC、Panel等多樣化品項，也與國際級系統商軟硬體整合，結合影像辨識、AI以及5G，打造獨特性的產品，並持續深耕在智慧移動平台的領域。 作為TIOT的研發工程師，我們從產品應用發想，並從使用情境著手設計產品，我們貼近市場，更與客戶成為合作夥伴。 此職務需要專業及豐富的硬體設計知識、邏輯判斷能力，應用整合能力，並且能嚴謹地的分析問題、解決問題。 期待您加入我們的團隊，與我們攜手在智慧移動平台的領域上成為專家吧! 職務說明: 1. X86 或 RISC 主機板電路設計。 2. 產品硬體訊號量測與功能驗証。 3. 客戶技術問題解決。 4. 需有獨立執行產品設計完整專案經驗。 ＊彈性工作時間，薪優福利佳，並備有新店/中和線交通車＊

1. 具備獨立設計X86板卡之相關經驗。 2. 熟悉OrCAD、Allegro、電子電路設計、PCB layout。 3. 熟悉產品設計、測試、除錯到量產等開發流程。 4. 具備良好的團隊協商與溝通能力。