美商宜普電源股份有限公司台灣分公司

Job Description: EPC is a technology leader and one of the leading suppliers of gallium nitride (GaN) power devices and IC products. Our business is growing rapidly and needs a strong candidate for our technology development team. Qualifications: • Candidate must have experience in semiconductor packaging design, assembly process, and product technology development with expertise in GaN product qualification • Experience in advanced packaging technologies using flip-chip interconnect on lead frame-based and pre-mold substrates • Excellent engineering problem-solving skills in failure analysis of any packaging and assembly process-related issues • Excellent communication skills to work with internal, cross-functional teams and assembly houses • Ability to take initiative and self-driven for results • High proficiency in English communication • Education: A bachelor’s degree in engineering or a master’s degree is preferred. Responsibilities: • Responsible for doing package design concepts for Gallium Nitride (GaN) power devices on low to mid-voltage applications and executing the packaging roadmap • Develop project plans, timelines, and product/package risk assessments that include working with program managers, device designers, reliability teams, application teams, and manufacturing suppliers • Manage assembly builds lots, implement all assembly/packaging design rules and specifications through design of experiments (DOE) or characterization, reliability testing, and qualification • Work with OSAT vendors to provide advanced packaging solutions from package concept to production • Experience in assembly processes such as flip-chip attach and mold processes is an advantage to having better interaction with the OSAT engineering team • Knowledgeable using CAD tools like AutoCAD or BricsCAD for package design and other documentation • Knowledgeable in Finite Element Analysis (FEA) using COMSOL is an advantage • Understanding of creepage and clearance requirements as per IPC standards • Strong understanding of packaging risk assessment, FMEA, and SPC to improve the assembly process • Team player with good interpersonal skills and able to work with multi-functional groups