Job Responsibility summary Broadcom Data Center Solution Group is seeking a talented and passionate engineer to join the R&D Systems Applications Engineering (SAE) team for a global organization that helps customers design, integrate, and maintain enterprise level products. SAEs work directly with top tier OEMs / ODMs, Field Application Engineers (FAE), and internal design engineers to launch new customer products and resolve complex technical issues in a timely manner. Also, managing substrate suppliers development projects, yield monitoring and improvements, capacity analysis, monitoring and reconciliation. Job Description Job Duties: Provides software development and consultation to prospective users and/or product capability assessment and validation. May work with Marketing to design and implement strategies. Provides technical expertise through presentations, product demonstrations, installation and maintenance of company products. Assists in assessing potential application of company products to meet customer needs and preparing detailed product specifications for the development and implementation of customer applications/solutions. May build a mini-application based on customer requirements to demonstrate feasibility of the application, often requiring rapid prototyping and/or product demo for client. - Knowledge: Internally recognized technical or business contributor uses skills to contribute to development of company objectives and principles and to achieve goals in creative and effective ways. • Possesses a specialized level of technical expertise or business acumen with accomplished track record • Networked within the industry and acknowledged expert by peers • Represents the company at industry forum and conferences • Develop and/or applies innovative technologies and concepts • Technical or business consulting resource to business level managers - Job Complexity / Contribution : Works on advanced complex technical projects or business issues requiring state of the art technical knowledge or industry. Recognized as the in-house expert on specific technologies. • May manage resources to achieve group objectives • Decisions have major impact on organization, both internally and externally - Supervision : Goals generally communicated in “solution” or project goal terms. Means of arriving at a solution not generally determined by other than the incumbent. • Sets direction for high-impact and/or long-range strategic/technical projects • Leads major initiatives/projects • Virtually self-supervisory Expectation: Bachelor of Science in Computer Engineering or related field plus 5 years of relevant experience (or Masters Degree in related field plus 3 years of relevant experience). Desirable, but not required skills Requirements/Qualifications Experience with firmware, host software, hardware, and PCIe protocol level debug. Experience developing and debugging C code. Prior experience in embedded software debug or development (firmware, drivers, BIOS) using PCIe technology. Experience reading board schematics and layout files. Skilled at debugging and analyzing high speed analog signals. Skilled in organizing information. Self-motivated and a strong self-driven learner who learns new technologies quickly. Good written, verbal communications skill as well as Presentation skills. Ability to prioritize and manage multiple parallel tasks. Strong interpersonal skills. Must be able to articulate and explain complex technical problems to customers and internal teams. Experience with NIC, SAS/SATA protocols, RAID, ARM or PPC embedded processors, logic analyzers, protocol analyzers, and oscilloscopes. Ability to perform SMD/SMT soldering and rework.

maintaining Linux drivers, particularly on the Broadcom platform. The ideal candidate will have over 10 years of experience in

禮聘具Marvel或Broadcom 網路IC 程式開發能力者 , 或熟悉 網路層L3 程式實務 開發 經驗者，薪資另議(本公司另提供高額開發獎金).

ex. WIFI, Bluetooth 2. Candidates with Qualcomm or Broadcom platforms experience will be given high priority 3.Familiar with

ex. WIFI, Bluetooth 2. Candidates with Qualcomm or Broadcom platforms experience will be given high priority 3.Familiar with

1. In charge of one of the following high-tech component product lines:Broadcom, ST Microelectronics, NXP, On Semi,

triple-play service, tr-247 is better. 5. Familiar with Qualcomm, Maxlinear, Broadcom platform and tools. 6. Familiar with

統合專案開發，技術支援，新人輔導，管理團隊。 1.Must be a team player and a problem solver. 2.Be able to provide technical support and lead a group of 5~8 engineers. 3.Be able to mentor new comers. 4.Accountable, manage and lead projects.

ESSENTIAL DUTIES AND RESPONSIBILITIES include, but are not limited to the following: - Attend kick off meeting to understand customer (internal and external) product specification requirements, translate and communicate requirements to internal team - Attend weekly technical team meeting to ensure execution excellence - Develop and maintain the processes and methods for design engagement documentation, system design & documentation, and requirements - Review to ensure respective design engagement activities are conducted according define process flow - Perform own technical assessment activities includes schematics analysis on critical components & with PCB routing design consideration before making proposal to customers - Ensure proposed solution and sample components meet requirement for initial design prototype testing & EVT build verification - Perform market research on newly developed and latest technological solutions and assess suitability for system architect’s consideration for platform design. - Adhere to all safety and health rules and regulations associated with this position and as directed by supervisor - Follow industrial trend (Intel, AMD, Ampere, Nvidia, OCP etc.) and bring updates to internal teams. - Comply and follow all procedures within the company security policy

b. Experience with OpenWrt and hardware platforms like Qualcomm, Broadcom, or MediaTek."

1. Switch chip SDK and PHY driver software development 2. Linux platform driver development for peripheral I2C/LPC/PCIe devices 3. Diagnostics software design for manufacture test 4. Design document writing 5. FW upgrade tool/script development

工作內容: 1.BringUp 2.Diagnostic development 3.Other software technology study & development *本職缺有出差需求，能接受短期1~3個月出差情形*(面試詳談)

1：肯學習，溝通能力佳，EQ佳，主動積極，抗壓性強。 2：協助客戶解決網路相關問題。 3：具備Cisco CCNA 證照，有其他IT證照尤佳。 4：具有網路、資安、無線網路 相關工作經驗尤佳。

1. 面對客戶溝通產品規格 2. 協調各功能模組開發整合 - 整合、debug，release firmware 3. Porting 軟體至新的平台，供其他模組開發

Analog Device, Broadcom, Qualcomm, ...等國際知名半導體品牌 6.主要客戶為鴻海、和碩、廣達、華碩、緯創、仁寶、研華、正文...等，有機會參與各大廠產品之研發專案 7.職稱依年資經驗及能力核定。 「FAE 工作願

1.協助採購至原廠系統，上傳客戶註冊資料 2.協助轉達業務並跟進產品變更通知之進度 3.產品-樣品規格書/承認書(英文)發行製作與管理 4.協助處理採購作業及進貨等文書處理事宜 5.主管指派專案支援

1. 網通產品RF硬體設計及工作經驗一年以上 2. 熟悉網通產品RF硬體架構及線路 3. WIFI 11a/b/g/n/ac/ax/be, Bluetooth, ZigBee相關產品之研發設計開發

文曄集團在全球有150個據點，在亞太地區具有智慧倉儲及系統整合的物流中心。 文曄提供良好的發展舞台及足夠的資源培訓菁英，若你/妳擅長跨團隊溝通、協調，對作業改善、系統流程優化與跨國工作有興趣，歡迎加入文曄一起共創最佳的半導體物流供應鏈中心！ 【Key tasks 工作內容】 ◆Optimize warehouse automation, layout, storage utilization and work flow 優化倉庫自動化，布局，規劃儲位與動線(空間利用最佳化，進出貨流程最佳化) ◆Define, map and deliver warehouse standards, such as inbound, outbound, delivery and inventory management 倉庫規範執行與佈達，訂定倉庫進貨、出貨、派送，與庫存管理標準作業 ◆Work with IT to establish the integration of systems for work process and necessary hardware 與IT協作，針對倉庫作業系統, 流程與設備提出優化(提升作業效率，降低作業錯誤率) ◆Familiar with system operation in order to collect and analyze data for further improvement 熟練進行系統資料與報表分析，做為決策與改善依據 ◆Report and perform the project progress 專案執行與回報 ◆Deliver effective training and knowledge transfer to site users 導入新專案流程/設備/系統並訓練倉儲作業員工 【Qualification應徵條件】 1. BS/BA majored in IE, Logistics, Transportation Management, SCM is preferred 大學以上，供應鏈管理、運籌、工業工程、商管等相關科系畢業尤佳。 2. Minimum 2 years of experience working within Supply Chain Operations, Logistic, Project Management is essential 具備倉儲物流、供應鏈相關或專案管理工作經歷2年以上 3. Verbal and written communication skill in English, Toeic scores above 750 英文能力佳 (Toeic 750分以上) 4. Cross function communication and coordination 跨單位溝通與協調 5. Team player 具團隊領導 【文曄簡介】 文曄集團為全球最大半導體元件代理商，為台灣的上市公司(股票代碼3036)，營收穩定成長，並致力於國際化發展，營運據點目前為15個，遍及全球。 我們代理全球超過400家一流半導體原廠，服務優質客戶超過25,000家，所經銷代理的產品線涵蓋主機板、筆記型電腦、通訊網路、影像產品、工業控制、車用電子、物聯網(IoT)、消費電子零件等高科技產品。不僅是代理產品，優質的技術Total Solution及迅速的服務團隊更完整地提供客戶全方位的資訊。 【其他條件】 因應改善及優化專案之執行，需能配合不定期出差香港等物流中心。

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