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Applications Engineer- Hsinchu

  • 新竹縣竹北市
  • 經歷不拘
  • 碩士

KLA Corporation, a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor, data storage, LED, and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for more than 35 years. Headquartered in Milpitas, Calif., KLA has dedicated customer operations and service centers around the world. Additional information may be found at www.kla.com. -Supporting wafer inspection products, including projects related to product adoption, product penetration, new product characterization, customer demonstrations and head-to-head (H2H) activities at customer facilities. -Responsible for generating best known method documents and other training material and transferring product knowledge to worldwide Field Applications team. -Work with customers to publish papers at industry symposiums or in technical journals. -Work closely with many organizations including engineering, sales and marketing within KLA and with customer engineers outside KLA. -Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors -Exercises judgment in selecting methods, techniques and evaluation criteria for obtaining results -Acts independently to determine methods and procedures on new or special assignments -Drive product adoption at customer site -Support HQ and local Business Unit to achieve their business goals Important Skills: • Be a driver • Successful with multiple cultures environment • Leadership competencies: successful execution of projects • Excellent presentation and communication skills • Handle multiple projects in parallel • Excellent problem solving skills • Use of professional concepts and company objectives in creative and effective ways • Understanding of how to use statistics to derive meaningful results

大於30人應徵

Product Installation Engineer- Hsinchu

  • 新竹縣竹北市
  • 經歷不拘
  • 大學

The Installation Engineer job is high profile and exciting opportunity for adventurous souls! Works under minimal direction from Management. Completes documented procedures and exercises judgment within defined procedures. Recommends changes to existing process and procedures. Primary responsibility is to strive for predictable Cycle Times and Warranty Starts for new tools installed and upgraded at our customer sites. Includes activities associated with setup, alignment, calibration, troubleshooting, diagnosing, and repairing of highly sophisticated capital equipment. Represents the company to the customer and assumes accountability for customer satisfaction with all installation/upgrade-associated activities. Assures operational quality of system equipment. Works directly with KLA regions and customers to verify new tool performance and transfer tool responsibility. Seeks warranty sign-off on newly installed tools Roles and Responsibilities • Installation of new tools in the field. Follows all procedures and provides a consistent result within specified cycle times. Achieves a predictable warranty start. • Evaluates, analyzes, diagnoses and fixes technical equipment problems related to installation. Can repair issues using standard procedures or innovate to resolve system problems which can have multiple causes. • Solving problems and repairs of sophisticated system level problems are based on Installation Engineer's technical knowledge and training. Installation Engineers seek help from Staff Engineers and Management when problems occur that may exceed knowledge, education and training. • Prepares field service reports and daily passdown on Installation progress and non-conformances. Contributes to post-activity Quality Feedback Report • Hold pre-installation meetings with the customer to scope customer unique requirements then create plans of action to measure and satisfy the unique needs. Execute plans of action and validate deliverables with the customer. • Meet with customer to facilitate warranty signoff after the activity is complete. • Acquires all vital international travel documents and manages their personal lives to be ready for domestic and occasional international travel. • Handles personal finances to prevent disruption to scheduled activities - even when traveling for extended periods. • Travels domestically and internationally by commercial transportation to customer sites. • Assists other engineers as necessary. Provides mentorship and technical assistance at customer sites. Can develop basic POAs. Provides phone and on-site support for junior engineers *Note: Only applications with *English resume* will be considered. *Please also apply through KLA Career page: https://careers.kla.com/

大於30人應徵

10/04 (APP)封裝製程開發工程師

  • 桃園市蘆竹區
  • 1年以上
  • 大學

擔任製程開發工作,完成模組樣品製作與生產文件撰寫。 1.功率產品封裝設計規格確認 2.功率元件封裝製程設計開發 3.封裝特性測試驗證及改善 4.新封裝材料評估 5.新封裝製程開發及設備評估 6.生產文件轉撰寫

待遇面議 上市上櫃 員工800人
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0~5人應徵

10/04 KH3403-封裝製程開發工程師-湖口區光復廠

  • 新竹縣湖口鄉
  • 3年以上
  • 大學

1.具封裝產品開發經驗,熟悉半導體封裝製程 2.具系統級封裝經驗為佳 3.具扇形封裝經驗後段經驗- SMT 製程、 Molding 製程、 SiP 製程相關站點 【薪資說明】 ◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人

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6~10人應徵

10/03 (台中)封裝製程工程師 Assembly Engineer-Die Saw

  • 台中市西屯區
  • 3年以上
  • 大學

1.Diagnose and resolve dicing process related problems by applying failure analysis, Determine root cause and implement corrective actions. 2.Define and maintain operation procedures 3.Define process edges and center the process (CPK) 4.Handling new process/machine/product baseline qualifications 5.Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step. 6.Optimize process and/or equipment variables. 7.Lead / participate in continuous yield improvement and cost reduction activities.

待遇面議 員工400人
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11~30人應徵

9/25 半導體業務專員(需有封裝製程相關工作經驗)

  • 高雄市左營區
  • 1年以上
  • 專科

<<需具有半導體封裝製程相關工作經驗>> 1. 開發潛在客戶,拓展市場,以達成業績目標。 2. 定期拜訪既有客戶,維繫穩定客戶關係及訂單取得。 3. 負責國內/外業務接洽及訂單處理。 4. 負責產品報價及產品展示,並處理應收帳款相關事宜。 5.

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0~5人應徵

10/03 (台中)封裝製程EMS工程師

  • 台中市西屯區
  • 10年以上
  • 大學

1. Bumping outsource management (solder and Cu pillar bump process) 2. Bumping whole process experience, have ability for bumping abnormal trobleshooting. 3. Have pakcage assembly experience is better

待遇面議 員工400人
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6~10人應徵

10/02 封裝製程副理_電動車碳化矽功率模組(SiC Power Module)_中壢

  • 桃園市中壢區
  • 10年以上
  • 碩士

1.負責新產品封裝後段製程(Molding/DDTF/Laser marking), 試產及製程改善 制訂製造程序 2.協助制訂產品標準 3.協助新產品開發及可行性評估 4.協助開發文件建立與管理 5.協助推動新產品APQP、PPAP

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0~5人應徵

10/02 封裝製程主任工程師_電動車碳化矽功率模組(SiC Power Module)_中壢

  • 桃園市中壢區
  • 3年以上
  • 碩士

1.負責新產品封裝後段製程(Molding/DDTF/Laser marking), 試產及製程改善 制訂製造程序 2.協助制訂產品標準 3.協助新產品開發及可行性評估 4.協助開發文件建立與管理 5.協助推動新產品APQP、PPAP

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11~30人應徵

9/27 AA/holder mount封裝製程工程師

  • 台中市南屯區
  • 經歷不拘
  • 大學

1. 協助工程品試做,生產機台自動化與功能改善 2. 新產品設計審核,失效模式分析,製程改善,產品良率分析與改善,降低成本研究 3. 生產工治具設計及繪圖 4. 其他主管交辦事項

待遇面議
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0~5人應徵

9/27 影像模組封裝製程工程師

  • 台中市南屯區
  • 3年以上
  • 專科

設備零配件設計與繪圖,生產SOP建立,人員教育訓練, 工程品試做, 新產品設計審核, 失效模式分析, 製程改善, 產品良率分析與改善,降低成本研究 生產設備維修保養,工治具設計與繪圖,稼動率維持, 維修保養標準作業書建立與維護, 協助工程品

待遇面議
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0~5人應徵

9/18 封裝工程副理/經理

  • 新竹縣竹北市
  • 6年以上
  • 大學

1)新產品開發封裝設計與需求討論確認及執行 2)封裝供應商規格及製程討論與確認 3)NPI與量產品之封裝管理(BD/BOM/POD...) 4)新型封裝技術研究 5)新供應商與技術研調

待遇面議 員工24人
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6~10人應徵

9/25 技術工程類-製程品質工程師(封裝-湖口廠)

  • 新竹縣湖口鄉
  • 經歷不拘
  • 大學

1.異常產品品質分析及良率提升 2.新產品(NP)工程品質改善/提升專案執行 3.IQC、OQC 4.撰寫8D report 5.客戶稽核準備與參與、內部稽核執行 6.需跨部門溝通(與研發、製程、客戶品質、設備等) *實際薪資依學歷、科系、相關

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11~30人應徵

9/30 Flip Chip製程工程師-半導體封裝中心Flip Chip Manufacturing Process Engineer-SEMI Assembly Center

  • 高雄市楠梓區
  • 1年以上
  • 大學

1.新產品之製程導入。 2.新產品之問題解析與改善。 3.協助新產品作業流程。 4.機台評估與參數設定。 5.追蹤新產品生產狀況與設計圖面。 P.S. 上班時間:日班(08:20~17:10)。   需可配合未來輪班:早班(07:35~19:

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6~10人應徵

9/25 PKG封裝開發工程師

  • 新竹市
  • 2年以上
  • 大學

1. 與封裝供應商合作開發新封裝及量產導入。 2. 對 MOSFET 封裝各階段製程參數進行生產可行性風險評估。 3. 新封裝製程開發評估,並管理開發階段之相關專案進度。 4. 具有豐富的IC封裝,功率半導體或電源元件封裝研發及生產經驗。 5.

待遇面議
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6~10人應徵

9/30 前段製程工程師/高級工程師/資深工程師-半導體封裝中心Front-end Process Engineer/Experienced & Senior eng. - SEMI Assembly Center

  • 高雄市楠梓區
  • 經歷不拘
  • 大學

1.製程設備參數設定,製程能力及良率提升。 2.新產品、新材料之製程導入 。 3.即時回應產線及客戶問題。 4.封裝製程專案執行。 P.S. 上班時間:日班(08:20~17:10)。   需可配合未來輪班:早班(07:35~19:35

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11~30人應徵
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