「Hardware Manager Lead (Contractor)」的相似工作

Responsibilities include: 1. Lead team or act the staff role to develop shelf controller module inside OCP ORV3 21 " or 19" rack to monitor and control Power and BBU shelf for data center. 2. Familiar with ARM Cortex A7 BMC AST2600/2620 chip or Intel x86 CPU design. 3. Experiences for Linux embedded board bring up and debugging. 4. Good knowledge of protocol for IPMI, I2C, UART, SPI RS485, Redfish. 5. Lead for schematic circuit design and PCB layout review. 6. Familiar with, CanBus, Modbus communication, ethernet, PoE, eMMC, security feature 7. Familiar with DC/DC converter circuit design, buck-bust converter and flyback . 8. Signal integrity and power integrity measurement and verification. 9. Support RFI and RFQ activities and provide technical proposal. 10. Good communication in English, both oral and written. Capable to talk and discuss technical topic in front of customer. Requirements: • BS in Electrical Engineering or related field. Prefer MS degree or above • 8+ years of related experience in consumer PC/Industrial PC, laptop, RISC and networking related products; for Team Lead prefer least 3 years for people manager role. • Demonstrated strong leadership for product design in multiple-disciplinary environment. • Competence in customer focus innovation and able to drive technology growth • Good communication skills, people management, self-motivation and the ability to successfully deal with ambiguity are a must. • Cadence Orcad capture or Mentor PADS capture. The information we collect: We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.

還未決定職涯下一站的你/妳, 這裡會讓你/妳在技術領域提升跟發揮的地方! IMS電子研發部為智能醫療服務處下的研發團隊,服務世界知名醫療大廠, 產品應用於醫美,牙科,醫學檢驗分析設備等。 產品類型有單板和系統皆為x86為大宗,其他產品配合醫療大廠作客製化. 對於這個職務，您可以透過參與專案來深入了解產業需求，並與海外設計服務團隊合作， 以超越過去的思考限制，進一步提升在醫療垂直領域的研發設計能力。同時， 透過與客戶和海外團隊的合作，您能夠擴展國際視野，提高個人競爭力。 職務說明: 1. RFQ 評估。 2. X86 主機板完整的電路設計。(懂Power DC/DC 設計佳) 3. 硬體訊號量測與功能驗証和問題解析。 4. 客戶技術問題的支援與排除。 5. 新技術的導入與分享。 6. 專案開發的產品Leader,並與BIOS,ME,SE,BMC,SW,EMC合作將產品開發完成. ＊彈性工作時間，薪優福利佳，並備有新店/中和線交通車＊

1. 工業用電腦主機板設計開發 2. 產品樣品階段測試驗證 3. 零件資料收集與管理 擁有 x86 硬體設計開發經驗的你(妳)，正在尋找下一個職涯發展的舞台嗎？ 廣積科技深耕工業電腦領域，產品應用涵蓋多個垂直市場，並已融入日常生活。加入我們，你(妳)將深入了解各產業的應用環境與法規，設計符合終端客戶需求的創新產品。 如果你(妳)對這個領域充滿熱忱，歡迎投遞履歷。

1. 電路設計與線路圖開發 • 負責筆記型電腦與桌上型電腦主機板的電路設計，包含電源管理、訊號處理與介面模組。 • 使用EDA工具繪製並優化線路圖，確保訊號完整性與電源穩定性。 • 選擇並整合關鍵硬體元件，滿足產品效能與成本需求。 2. 硬體驗證與問題診斷 • 制定測試計畫並執行硬體功能驗證，確保設計符合規格與穩定性要求。 • 使用示波器、多用電表等工具進行電路除錯，分析並解決硬體異常問題。 • 優化設計以提升效能、降低功耗或解決熱管理挑戰。 3. 跨部門協作與技術支援 • 與BIOS/UEFI團隊合作，確保硬體與固件的無縫整合與相容性。 • 支援製造部門進行原型製作與量產轉換，解決生產過程中的技術問題。 • 提供客戶（OEM/ODM廠商）與內部團隊硬體設計相關的技術諮詢。

1. 電腦主機板線路設計、驗證及除錯。 2. 平板電腦、醫療電腦、車載電腦、工業電腦等應用研發。 3. 可獨立承接專案設計與協助檢查電路設計 4. 有主機板電源設計經驗者尤佳 5. PCB Layout 檢查 6. 處理產品零件替換料 。

1.消費性電子硬件工程 2.硬件問題協助分析

我們正在尋找有2年以上工作經驗的硬體研發工程師，這個角色將賦予你全方位的責任和挑戰，如果你熱愛技術、喜歡解決難題，並希望在一個高度支持創新的環境中成長，這個職務你絕對不能錯過！我們期待你的加入！ 【工作內容】 1. 硬體設計與開發： 承擔整個硬體設計的責任，從初步規格需求分析到電路設計、PCB佈線與分析及電子元件選型，並且具備使用專業硬體設計工具的經驗，確保每一個步驟都符合規格至最終的測試與量產。 2. EVT測試： 負責開發和優化產品，並對其進行EVT測試，確保產品的穩定性和可靠性。 3. 技術支援與問題解決： 在產品開發過程中提供技術支援，解決開發和生產中遇到的硬體問題。 4. 跨部門協作： 與軟體開發團隊、產品經理及其他相關部門緊密合作，提出實際可行的優化建議。 5. 技術文件編寫與知識分享： 需要編寫清晰的設計文檔、測試報告和技術手冊，並能有效地將您的知識與團隊成員分享，相互分享技能和理解。

1.負責產品硬體研發 2.電子電路設計、驗證與除錯 3.PCB LAYOUT 4.零件料號申請、BOM表建立與修改 5.跨單位研發團隊合作開發設計、量測驗證、認證、問題協調及解決 6.安規零件資料整理製作 7.試產階段支援工廠生產單位並協助導入量產 8.協助解決客戶反饋問題等相關事務

1.客戶公版/產品EVB 電路設計/韌體修改與開發 1-1 Demo board 電路設計 / PCB layout review 1-2 Customer product specification review 1-3 客戶應用公版硬體/韌體修改與提供建議 1-4 客戶專案硬體/韌體修改 1-5 協力廠商專案合作 1-6 系統的驗證測試 2. 協助SE/RD認證CHIP/系統驗証 3. 協助FAE解決客戶問題 4. 產品整體系統的規劃與開發研究 5. Schematic design with Cadence OrCAD 6. PCB circuit design with Mentor PADs 7. Gerber file review 8. PCBA circuit verification & SMD soldering rework 9. Oscilloscope /LA/NA operating to Hi-Speed/Differential Signal analysis 10 EMS/EMI certification & Debug. **依經歷核敘職稱

----- Hardware Engineer Position Position Overview: We are seeking a talented and motivated Hardware Engineer to join our dynamic team in the drone technology sector. In this role, you will play a critical part in the design and development of power and communication systems for both drones and their remote controllers. Your expertise will contribute to enhancing the efficiency and reliability of our cutting-edge drone solutions. Key Responsibilities: HW engineers in the drone industry are responsible mainly for the power system and communication system, either in drones or remote controllers. A HW engineer should be able to analyze and design the power distribution and data flow of the system. Should be able to design tests to verify design (or come out a test plan) , then conduct the design verification tests accordingly. Based on the test data, HW engineers need to propose system updates. Sometimes failures happen, HOW engineers should work with SW engineers, to find the root cause and come out with a failure report. Later, a fix needs to be proposed. Thus, the ability of a HW engineer should have: 1. Read and write in English, this is to study the specifications, standards, query vendors, and discuss issues with people all over the world. 2. Analyze a power system, calculate the power consumption, to check margin. Summarize the power system into a tree graph. 3. Analyze a communication system, estimate the data rate and data flow. Summarize data flow into block diagrams. 4. Conduct some circuitry reworks, handmade some functional circuits like debug board or power board. 5. Follow procedures to conduct tests. Senior HW engineer should have: 1. Coordinate SW, mechanical engineers to design a prototype. 2. Coordinate production engineers to schedule a manufacturing process. 3. Coordinate buyer or assistant to procure material. 4. Work with FW engineers to bring up the prototype. 5. Work with quality engineers to test product wise. Solve the quality issue in tests, including all HW, SW, Mechanical issues. 5. Work with a compliance engineer to pass the regulations and get certifications. Hardware Engineer Responsibilities: In addition to the above responsibilities, the Senior Hardware Engineer will: Cross-Functional Coordination: Collaborate with software and mechanical engineers in the design and development of prototypes. Coordinate with production engineers to schedule the manufacturing process efficiently. Work alongside procurement specialists to ensure timely acquisition of materials. Prototype Development: Collaborate with firmware engineers to bring prototypes to life and understand their functionality. Quality and Compliance Oversight: Work closely with quality engineers to conduct product testing, addressing any hardware, software, or mechanical issues that arise. Partner with compliance engineers to ensure all products meet regulatory standards and achieve necessary certifications.

- ARM based SoC system design using nVidia, Ambarella, NXP, QUALCOMM platform. - Edge AI camera design integrated with 2D/3D camera, Wifi, PoE, Display and battery. - 硬體研發及測試技術: 1. 硬體線路設計驗證及除錯 2. 高速數位訊號量測及分析 (MIPI-CSI or DSI, Wi-Fi or BLE 4.0) 3. PCB Layout檢查及驗證 4. BOM表建立與檢察 5. 其他主管交辦事項

1.國內外醫學、生醫、機械、電機、電子等相關系所畢業。 2.具醫療器材產品研發5年以上實務經驗，熟悉 FDA&MDR醫療法規者。 3.熟悉品質管理系統(ISO13485)，具有電子產品經驗能力者。 4.產品開發之策略擬定 5.各項研發專案之規劃推與管理 6.具有策略規劃及團隊領導能力 7.具備良好的人際關係與跨部門溝通協調能力

1. 技術可行性分析，硬體線路及高速訊號設計。 2. 熟練PCBA power budget填寫，具備和DC power開機時序以及接口定義。 3. 熟練GPIO table填寫，具備和BIOS/EC溝通協作能力。 4. 熟悉PCBA 開發流程，BOM以及工廠製造文件如deviation，生產加工注意事項產出。 5. 審查SCH/ PCB Layout，依據客戶要求產出SCH checklist/Layout checklist。 6. 樣品測試/偵錯/修正。 7. 數據資料分析與報告。 8. 供應商聯繫，利用廠商資源進行design review 以及Issue debug。 9. 優化設計及降低成本能力。 10. 產品/元件失效分析與風險評估。 11. 可直接面對客戶或消費者端技術支援。 12. 電路分析，失效分析與除錯。 13. 孰悉PCBA design and test spec。 14. 良好的溝通協調能力，熟悉和BIOS/DC/PM/Layout/SE/EMC/SPM合作模式。

1.專案產品開發與管理 2.產品開發成本管控 3.產品生產技轉與試產執行 4.熟悉x86架構與系統整合 5.熟悉IPC 單板/EPC/PPC/Tablet產業應用 6.可獨立應對客製化專案需求(產品架構組成, 成本與售價評估, 時程預估與管控) 7.IPC產品企劃與開發經驗(具備 5年以上 工控單板, EPC/PPC 相關工作經驗)。 Job Description： 1.Product developent and management 2.Product cost control and management 3.Product pilot run plan and execute 4.Familiar in x86 platform and system intergration 5.Familiar in IPC mainboard, EPC/PPC market application 6.Able to work independently to evaluate customized request(product inquiry to proposal, cost and quotation evaluation, schedule planning and control) 7.Experienced in IPC product management and development (5 year experience in mainboard, EPC/PPC ).

艾訊TIOT提供各種移動式載具、運具、運輸營運站體等場域完整的系統解決方案。我們除了提供強固型高效能的BOX PC、Panel PC、Panel等多樣化品項，也與國際級系統商軟硬體整合，結合影像辨識、AI以及5G，打造獨特性的產品，並持續深耕在智慧移動平台的領域。 作為TIOT的研發工程師，我們從產品應用發想，並從使用情境著手設計產品，我們貼近市場，更與客戶成為合作夥伴。 此職務需要專業及豐富的硬體設計知識、邏輯判斷能力，應用整合能力，並且能嚴謹地的分析問題、解決問題。 期待您加入我們的團隊，與我們攜手在智慧移動平台的領域上成為專家吧! 職務說明: 1. X86 或 RISC 主機板電路設計。 2. 產品硬體訊號量測與功能驗証。 3. 客戶技術問題解決。 4. 需有獨立執行產品設計完整專案經驗。 ＊彈性工作時間，薪優福利佳，並備有新店/中和線交通車＊

1. Motherboard schematics design/debug ,at least 5 years experience 2. Familiar with X86 experience is better 3. RISC design experience is better 4. Need to co-work with BIOS and Mechanical RD 5. Prepare related design documents 6. Have experience in Motherboard /Server board /Notebook 7. Making BOM 8. Layout review

1. 電腦主機板設計及除錯。 2. 特殊產業電腦應用開發。 3. 處理產品零件替換料 。

我們正在尋找一位硬體測試工程師，負責電路板的設計、製作與測試，並支援物聯網設備的開發、測試與改裝。此角色將參與新硬體的開發流程，從設計階段到測試驗證，確保設備的穩定性與可靠性。 主要職責： * 電路板設計與製作：獨立完成電路板的設計、佈線（PCB Layout）、打樣、焊接與測試。 * 物聯網感測器與韌體測試：使用公司開發的晶片與韌體，進行感測器與設備測試，並提供調整建議。 * 硬體設備改裝與優化：依據需求，改裝與優化物聯網設備，提高其性能與安全性。 * 研發設備組裝與實驗：參與研發設備的組裝、測試與實驗，確保功能達標並記錄測試結果。 * 客製化與出貨檢料：協助物聯網設備的客製化開發，並在出貨前進行硬體檢查與驗證。 * 資料串聯與驗證：驗證感測器資料的正確性，並確保數據能夠順利串聯至雲端服務，提升系統整合效率。 職位要求： * 具備電子電路設計能力，能獨立完成 PCB 設計、Layout、打樣與測試。 * 熟悉電子元件特性與電路分析，能進行電路板焊接與除錯。 * 熟悉示波器、萬用電表等電子測試儀器，能進行測試與故障排除。 * 了解嵌入式系統與物聯網技術，能與韌體工程師協作進行測試與優化。 * 具備良好的問題解決能力與動手實作能力，能獨立處理新硬體設計與測試挑戰。 * 有 AI MCU 或其他物聯網設備開發經驗者優先。 如果你對物聯網硬體開發充滿熱情，並且具備獨立設計與測試電路板的能力，歡迎加入我們的研發團隊，一起打造創新的物聯網設備！

Job Summary: The Electronics Technician supports the engineering team by performing critical tasks such as soldering and rework on PCBAs (Printed Circuit Board Assemblies), conducting electrical tests, managing lab equipement, and maintaining a safe and organized work environment. This role is essential in supporiting engineering projects, ensuring the functionality of electronic components, and contributing to the development of new electronic systems. The Technician will work closely with Electrical Engineers to troubleshoot, test, and improve prototypes and production systems. Key Responsibilities: 1. Testing, Soldering, and Rework: -Perform soldering and rework on PCBAs as required, ensuring high-quality connections and component placement. -Conduct electrical tests on circuits, PCBAs, and electronic systems based on instructions from Electrical/Electronics Engineers. -Assist in debugging prototype units and providing feedback on test results to support engineeing decisions. 2.Lab Equipment and Maintenance: -Manage and maintain lab equipment, ensuring all tools and instrumnets(e.g., oscilloscopes, multimeters, function generators) are properly calibrated and functional. -Perform routine maintenance on test equiment, identifying and troubleshooting any issues as they arise. 3.Documentation and Reporting: -Record test results, maintain detailed lab documentation, and report findings to the engineering team. -Assist in creating and updating technical documentation, including standard operating procedures (SOPs) for lab equipment and testing procedures. -Generate reports summarizing testing outcomes, issues identified, and corretive actions taken. 4.Material Holding and Lab Supplies: -Manage New Part Requests (NPR) and Purchase Requests (PR) for components, parts, and materials required for engineeing projects. -Handle the receipt, storage, and shipment of electiacal engineering materals and tools. -Ensure that materials are organized and available when needed for projects, reducing delays in engineering development. 5.Collaboration and Project Support: -Work closely with Electical Engineers to support project development, troubleshooting issues, and ensuring protoypes and sytems meet specifications. -Provide hands-on support to engineering teams duiring system testing, rework, and asseembly of electronic systems. -Participate in continuous improvement efforts to enhance lab operations and effciency in testing and maintenance procedures.

Roles & Responsibilities: -To design High-Speed/High Density (Multi-Layer, Up to 46 layers) PCB Layout projects. Challenges involve highly complex electrical & mechanilcal contraint driven designs, high density interconnects and packaging, meeting client's SI,EMC, DFM, DFA, DFT. -Troubleshooting and fault finding in PCB layout at Design level. -Placement of components based on mechanical constranints and schematic flow. -Routing of signal based on SI constraints. -DFx Analysis implementation. -PCB Manufacturing/Assembly files Geneation.