工作內容
1.Lead project post-silicon stage and communicate with customer in TW/JP/US/EU/CN. 2.Coordinate with PM, product, testing, packaging, reliability and backend team during prototyping and production stages for achieving delivery target. 3.Support Sales/CS to be a good bridge between customer requirements and ASIC manufacturing supports. 4.Wafer Process, WAT, CP, Assembly, FT, BI, RA and SLT monitoring, yield analysis, maintenance, and improvement.
職務類別
工作待遇
待遇面議
（經常性薪資達 4 萬元或以上）
工作性質
管理責任
出差外派
上班時段
休假制度
可上班日
需求人數
條件要求
其他條件
1.Familiar with SoC Design flow, CMOS device and IC process. 2.Familiar with yield analysis, yield improvement, and failure analysis. 3.Familiar with characterization and component qualification. 4.With the experiences to co-work with test and design teams to define MP testing spec. 5.Fluent in English writing, reading and oral communication. 6.Fab process knowledge. 7.Testing related knowledge. 8.Package and assembly related knowledge. 9.Automotive production knowledge.
公司環境照片(2張)
Hsinchu Office
Taipei Office
福利制度
法定項目
其他福利
1.分紅奬金 (依公司獲利、組織目標達成率與個人績效決定) 2.三節獎金 3.勞健保及退休金提撥 4.員工團保 (意外、壽險及防癌險) 5.國內外旅遊/旅遊補助 6.工程師介紹獎金 7.全薪病假及彈性休假 8.員工汽機車停車位或交通津貼 9.員工健康檢查 10.福委會相關福利活動
聯絡方式
聯絡人
智能客服