【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=276&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities 1. Handle Nano Diffusion, Thin Film, or Etching equipment. 2. Improve and enhance the efficiency of equipment. 3. Plan and execute the analysis or defect detection projects. 4. Communicate with cross function engineers or vendors.
待遇面議
(經常性薪資達 4 萬元或以上)
1. Bachelor degree and above. Major in Electronics, Electrical Engineering, Mechanical and Automation Engineering related fields. 2. Having experience with equipment maintenance or improvement is a plus. 3. Have basic mechanical related knowledge. Having the semiconductor processes knowledge is a plus. 4. Good problem solving skills, communication ability, team spirit, active learning attitude and is adequate in English.
詳見企業網站 http://www.tsmc.com/chinese/careers/compensation_benefits.htm 如欲投遞履歷,請上台積官網 http://www.tsmc.com/chinese/careers/index.htm