台灣瑞薩電子股份有限公司

■Job Description Represent Renesas FPGA product line, especially in APAC region. Lead our teams to provide trainings and technical support for customers/FAE/sales/distributors on our FPGA products, hardware, software, and documentation. Principal Accountabilities: -Present trainings to customers and related teams (AE/FAE/Sales/Disti) -Provide technical support, including advising customers how to import their designs and optimize for best performance to fit in our products. -Review HW, SW, Documentation. -Feedback issues from field to internal teams and drive them to improve our products and related HW/SW/Documentation accordingly. -Create new documentation such as application notes and training slides. -Create of new IP modules to add to our FPGA library. -Mentor AE teams globally in FPGA. -Contribute solutions and innovations. Key Relationships: -Customers / Distributors -Marketing / FAE / Sales -Development and support teams: Hardware, Software, Design, Product Definition, --Product Engineering, Test Engineering, Applications Engineering ■Qualifications / Key Performance Measures: -Customer and other upport case completion -Support material publication -Presentations and training events -7+ yrs experience in FPGA design using Verilog -Excellent communication / presentation skills -Fluent technical English and Mandarin -BSEE or equivalent (MSEE preferred)

■Job Description - Study and comprehend specification requirements. Ability to participate discussion proactively. - Based on OOP to learn systemverilog and UVM. Then create testbench from scratch to write stimulus and checker. Learn Systemverilog Assertions(SVA) and apply the technique to ensure interface protocol/specification robust. - Study Constrained Random Verification (CRV) approach and apply coverage-driven method for closure. - Support digital designer(s) to debug issues. Create directed tests to address corner cases and designer concerns. - Develop work–around solutions where necessary to overcome device errata. - Learn to maximize reusability when developing testbench/VIP packages and how to make a scalable testbench across derivative projects’ configurations. ■Key Responsibilities - Unit level Testbench maintenance/ownership. - Top level Testbench participation/maintenance. - Coverage closure enhancement. - Regression debugging and fixes to test/environment/checker file(s). - Interface with Digital Designer to drive consensus around grey-area during specification cooking. ■Qualifications - University degree in Electrical / Electronic Engineering or Computer Science - Expertise in Digital logic/circuit design - Expertise in Object-Oriented Programming (OOP) and skilled in language such as C++/SystemVerilog - Scripting skills with: Perl/Python, Makefile and familiar with RegEx - Familiarity with FPGA is a plus - Hardware debugging skills is a plus - Results-oriented and able to deliver on-time under tight schedule pressure. - Ability to work both independently and part of a team. •Fluent written and verbal skills in English, as well as Mandarin

■Job Description - Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging. - Package technologies qualification for consumer & industrial power as well as automotive power applications. ■Key Responsibilities - Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM). - Work with OSAT/CM to develop, run DOE to optimize processes, establish process spec & monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer. - Work with Product groups and Reliability team, qualify new packages and processes within required time frame & further address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses. - Ensure smooth transition into production & implement ramp up monitor. - Participate in packaging roadmap development & focus on execution, develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging and flip chip interconnects. - Establish & maintain package design rules. ■Qualifications - Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. - 6-12 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging. - Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software. - Strong interpersonal and communication skills. - Strong analytical and presentation skills. - Knowledge of wire-bonding & multi-chip module technologies a plus. - Fluent Chinese and English skill

■What we need: The Renesas Infrastructure Power team is seeking a Sr. Manager level leader for our Asia-based applications team. This position is based in Taipei, Taiwan. Working closely with our sales, FAE team and customers, you will align technical resources to get excellent customer experience. Excellent communication skills and technical knowledge are required as you will work between the product development teams and the customer to ensure expectations are understood and met. We’re looking for someone eager to tackle a challenge and help define the new frontier of 48V DC/DC power management. If you want to be at the nexus of cutting-edge digital power management technology and direct customer engagement, we’d like to hear from you. ■Job Description Seeking a leader to propel our applications team to the next level of customer experience delivery and team capability growth. Your ability to work across functional groups through formal communication and direct interaction is critical to ensure alignment with the global team. The position is the interfaces with product, test, and design engineering with a focus on customer systems application/design-in and collateral related tasks for new and existing products. ■Responsibilities ・Provide experienced leadership to the applications engineering team. Identify areas of growth for team members and drive improvement. Enable the team to understand and take ownership of the customer experience vision. ・Own relationships and alignment with counterpart FAE/Sales leaders. Deeply comprehend customer expectations and personality to enable prioritization. Investigate and verify advanced solutions to meet the latest requirements of 48V ・DC/DC application and maintain exited 48V solutions with reference design, demo, review of customer design, troubleshooting and quality issue support. Hand-on work is needed. ■Qualifications - 10+ years hand-on experience in the DC/DC or AC/DC power module industry - More than 3+ years team management experience with leading a technical team with a customer focus - Experience of 48V DC/DC in power module or IC company is preferred. - Good understanding of basic topology, control loop theory, application in power converters, simulation, PCB CAD tools, excellent lab-based problem-solving skills, - Experience working directly with large tier 1 customers in power management - able to communicate with foreign colleagues about technical questions in English

■Company Description Renesas is Seeking customer facing application engineer to support AI power module products across diverse market opportunities. our power modules excel in power density and efficiency, delivering top-tier performance for high-performance computing and data centers, key applications include Artificial Intelligence, High Performance Networking, and advance computing systems. This is one of Renesas’ fastest growing and exciting product line. ■Job Description - Analyze customer requirements and recommend optimal power module solution from our existing portfolio, including multiphase controllers. - Support customers through the development process, from product selection and schematic/layout reviews to debugging during the New Product Introduction (NPI) stage. - Provide recommendation for passive external components on the PCB and module to multiphase-controller connections. - Validate customer use cases to ensure they align with the recommended operation range specified in the module datasheet. - Collaborate with the field application engineers globally to keep them informed about our latest module offerings. - Provide technical support and engage in face-to-face discussions with customers based in Taiwan ■Qualifications - MSEE /BSEE with 5+ years of experience with a focus on power electronics. - 2+ years related experience in multiphase power solutions or power modules for data centers - Prior experience in customer supporting roles - Excellent English written/verbal communication skills to engage with customers and field teams

■Company Description Renesas is seeking module design senior manager to lead the AI High Density Power Modules design team. These products push the technology limits of speed, density, and efficiency and deliver power to the highest performance computing and connectivity functions. Typical applications include Artificial Intelligence, High Performance Networking, and other High Performance Computing applications. This role sits within our Performance Computing Power business, which is one of the fastest-growing and exciting product lines at Renesas, with a multi-market scope and a large product development team. ■Job Description - Collaborate closely with cross-functional teams (mechanical, software, and systems engineering) to ensure seamless integration of power modules within larger electrical systems and drive alignment on thermal and power requirements. - Define project scope, goals, and deliverables in alignment with organizational objectives. - Develop and monitor project schedules, budgets, and resource allocation to ensure timely delivery to customer needs. - Present project updates and proposals to senior management and key stake holders. - Work with our internal and external manufacturing partners to prototype designs and bring them to manufacturing. ■Qualifications - MSEE /BSEE with 10+ years of experience with a focus on power electronics. - 5+ years managing power module engineering teams. - Proven track record building a high performance team and attract talent. - Excellent communication and teamwork skills - Exceptional communication and interpersonal skills to engage with team members and stakeholders at all levels. - Demonstrated ability to solve complex technical problems and make data-driven decisions.

Job Description You’ll be working for Renesas Electronics, one of the fastest growing Semiconductor companies in Europe, so you’ll get exposure to a high performing, fast paced and global business. Define testbench infrastructure using SystemVerilog, UVM and Formal. Responsible for complete digital level verification. Modeling of analog functions in SystemVerilog. Responsible for complete chip level verification of mixed signal IC. Work closely with design team to architect a new design verification environment and produce high quality verification closure. Infrastructure work including developing scripts, methodologies and tools for efficiency and quality improvements. Qualifications: 8+ years of experience in ASIC/IC verification. Experience in UVM based verification flow. Good understanding of OOP concepts Familiar with scripting language like Makefile, Perl, Tcl or Python. Experience in SimVision or Verdi debug skills. Experience in Assertion and formal verification (Jasper, 0-in, IFV, Model checking) is a plus.