新竹市6年以上大學以上待遇面議
THE PERSON:
The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have in-depth technical knowledge, excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to develop a career in AMD.
KEY RESPONSIBILITIES:
- Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package (CoWoS, 2.5DIC, 3DIC, InFO, SoIC…) devices
- Collaborate with foundry and OSAT suppliers to define process flow and process control to enable high volume manufacturing.
- Drive manufacturing process quality through FMEA and lead comprehensive reliability evaluations to determine the quality and reliability margin for the product.
- Drive data analytics program and detect manufacturing and product quality excursion to safeguard product quality.
- Research and develop solutions to enhance package reliability for end users.
- Innovate methods to add more value to the product through optimizing product cost, yield and performance.
- Leads establishment, review and audit of manufacturing specification, control plan and FMEA for all assembly & substrate suppliers.
- Lead collaboration with suppliers to meet AMD's goals (cost, yield, quality and reliability) and continuous improvement activities.
- Lead investigations, risk assessments on quality activities including PCN, lot on holds, issues including MRB, customer complaints, RMA.
PREFERRED EXPERIENCE:
- 10+ years of hand on experience in end to end of Advance Package (CoWoS, 2.5DIC, 3DIC, SoIC…) assembly process.
- Strong knowledge in FMEA & Control Plan methodology
- Strong knowledge in data analysis tools (JMP, Snowflake, Power BI…etc.)
- Experience on substrate, bump and assembly integration
- Familiar with tools (failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)
- Supplier quality management experience and a deep understanding of problem-solving tools including 8D principle and statistical process control principles
- Strong leadership and interpersonal skills with effective communication & presentation skills
- Track record of development work leading to volume production in Semiconductor manufacturing
- Dedicated and able to work with minimum supervision
ACADEMIC CREDENTIALS:
Bachelor/MS degree in Engineering
LOCATION:
Hsinchu, Taiwan