台灣積體電路製造股份有限公司(台積電)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=440&source=104 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 說明: 1. 於無塵室內工作，需穿著整套無塵服裝(無塵室恆溫約21度) 2. 負責光罩製造機台操作、檢驗光罩品質、異常狀況回報(不會接觸化學溶液) 3. 採四輪二班制：工作兩天，休息兩天 4. 須輪班：配合廠區跟單位調度輪調，每半年做日夜輪調 5. 工作時間：每天上班12小時(含兩小時休息時間)，日班-7:20AM~7:20PM；夜班-7:20PM~翌日7:20AM 6. 日班總月薪約32,000元；夜班總月薪約 43,000元；另享有分紅獎金，平均年薪達75萬元以上

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=431&source=104 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 台灣積體電路製造股份有限公司(台積公司)致力於維護身心障礙者就業權益。依身心障礙者權益保障法, 特別規劃聘僱身障人才專區，歡迎領有身障手冊或證明者加入台積公司！ 說明 1. 未來3DIC架構探索及評估 2. 3DIC 信號完整性、電源完整性以及系統效能的模擬

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=433&source=104 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 台灣積體電路製造股份有限公司(台積公司)致力於維護身心障礙者就業權益。依身心障礙者權益保障法, 特別規劃聘僱身障人才專區，歡迎領有身障手冊或證明者加入台積公司！ 說明 1.3DIC晶片級、封裝級與系統級散熱方案探索及評估 2.數值模擬與量測

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=353&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Development of world-class cutting-edge technology, and responsible for the success of the A14/N2 technology: (1) Process integration across process modules, including test key design, tape out, device analysis, simulation, model, and robust. (2) Test key designs for design rule validation, electrical modeling, and yield learning. (3) Characterization of state-of-the-art devices, spice targets' setting for modelling, occasional bench measurement. (4) Lot handling: periodically serves as on-duty engineer to coordinate device lots' handling. 2. Advanced process integration development: integration and baseline sustaining to meet process KPIs on performance/ yield/ reliability/ manufacturability in A14/N2 program. 3. Advanced integration baseline process transfer to volume production. 4. Data analysis to identify the issue and issue owner. 5. Co-work with various teams to evaluate new processes and solve the issue. 6. Routine integration logistic job.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=462&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Role: TSMC AI team is developing the next-generation technologies that change how high-tech manufacturing works. We're looking for engineers and data scientists who are passionate about bringing new ideas from diverse areas and love working with complex data, finding insights, and presenting findings to peers, management, and internal customers. As a key member of a small and versatile team, you will design and implement machine learning algorithms that support TSMC R&D/Fab/Business/IT/Security functions to improve productivity and quality of work. Responsibility: 1. AI solution development and strategy implementation for manufacturing processes improvement. 2. Perform data scientist role from data collection, data exploration, feature engineering, model evaluation, to error analysis. 3. Exercise sound judgement to determine if business problems can be solved through AI/ML and communicate results with domain users for model explanation or error analysis. 4. Perform model lifecycle management to ensure model validity in production.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=545&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1.Hands on SOC chip/ block implementation from gate level netlist to GDS tape-out. 2.Develop IC design methodology 3.Chip tape-out; Design methodology development

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=346&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Compile and present reports, forecasts, budgets, business plans, and financial statements. 2. Provide financial information by researching and analyzing accounting data. 3. Perform ad hoc analysis and projects as requested.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=541&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Role: Software Engineer, Backend Development at TSMC IT focus on designing the most flexible, scalable backend architecture with optimized performance to support TSMC world-class manufacture, engineering and business systems. The ideal candidate has a highly technical multi-discipline engineering skillset that can push the limits of complex system design at large scale. Responsibilities: 1.Implement the features and services of backend for TSMC software products 2.Develop state-of-the-art code 3.Continue to refactor existing applications 4.Contribute to write tests to ensure software quality 5.Apply software design principles to ensure software quality 6.Ensure sustainability and performance of software applications 7.Willing to learn new IT technologies

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=343&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibility: 1. Design CMOS Image Sensor (CIS) & depth sensor related test chips for process development 2. Design CIS or non-CIS test lines or test chips for process monitoring and improvement 3. Data acquisition and analysis: CIS key performance indices and random noises characterization

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=507&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Are you looking for an opportunity to join one of the most influential semiconductor companies that is changing our world? TSMC Corporate Planning Organization (CPO) plays a strategic role in TSMC’s growth. We develop global planning and provide quick responsiveness to coordinate needs between factories and customers, driving for business effectiveness to bring world-changing innovation into reality. CPO is looking for Corporate Planning Associates. As an Associate, you will be rotated to a variety of roles in the 1st year to gain broad exposure to TSMC CPO. The rotation may cover several of following roles, operation resources planning, production planning, business operations, corporate pricing, advanced package supply chain solution, integrated & intelligent planning, and strategic platform intelligence. After successfully completing the rotation program, you will be placed in a role that matches your interests as well as to fulfill business needs. For further information about CPO associate program, please refer to the attachment on our career website.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=488&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Corporate learning platform (LMS) daily management and operations 2. Corporate learning platform (LMS) training business user communications, training, and account services 3. Overall central helpdesk coordination for corporate learning platform (LMS), including business users’ troubleshooting and related in-depth analysis 4. Hardware and software management and operations for e-learning course productions 5. Digital learning technology research and implementation

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=311&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: The role is responsible for providing high quality, efficient, and effective integrated services to Taiwan customers. 1.Handle customer's tapeouts, prototyping and production 2.Prepare and host customer meetings and visits, and follow up with action items 3.Clarify customer's requests and act as issue owner for integrated customer-centric response 4.Track customer account/ project's status and escalate customer's issues to management

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址： https://careers.tsmc.com/careers/JobDetail?jobId=423&source=104 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 台灣積體電路製造股份有限公司(台積公司)致力於維護身心障礙者就業權益。依身心障礙者權益保障法, 特別規劃聘僱身障人才專區，歡迎領有身障手冊或證明者加入台積公司！ 說明: 1. FAB量測機台操作、FAB晶片檢驗(切割、 送測)、工程HOT LOT追蹤、工程報表分析、異常問題反應 2. 工程晶片帳料管理 3. 協助工程師處理異常工程晶片 4. 採四輪二班制：工作兩天，休息兩天 5. 需輪班：三個月夜班、三個月日班、不限定A或B班依部門任務狀況座彈性調整 6. 工作待遇：日班總月薪約32,000元；夜班總月薪約 43,000元；另享有分紅獎金，平均年薪達75萬元以上 【謝謝您對台積電職缺的興趣，我們的招募團隊會仔細審閱每份投遞的履歷。若您的資歷符合職缺需求，我們會在收到履歷的一個月內盡速與您聯繫。】

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=536&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Role: Are you a creative IT professional with strong technical aptitude who embraces changes and is passionate about data and information? We invite you to join our highly innovative data engineering team which is constantly designing, developing, and delivering high quality solutions for our customers. As a data engineer, you will have opportunities to work in a dynamic and fast-paced environment to collaborate with business functions to design solutions. You will translate business requirements into technical needs, connect and automate data pipelines, and deliver data architecture and data governance solutions. Responsibility: 1.Perform IT system architecture design, new technology research, and provide recommendation. 2.Design and implement optimal data pipeline architecture (considered high data volume, data governance, etc.) 3.Work with PRODUCT/BIZ teams to assist with new data platform re-engineering or data-related technical issues 4.DataOps high availability NoSQL DB (e.g.: Cassandra, S3/MinIO, MariaDB, etc.) on K8s environment.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=518&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: The responsibilities of this role include developing data pipelines (collection, extraction, processing, representation, management) for data scientists focused on developing intelligence from structured (transactional) data and unstructured (e.g., text) data with Artificial Intelligence (AI)-enabled analytics procedures. Ideal candidates would have either a Bachelor’s or Master’s degree in computer science, information systems, information science or related fields.

【本職缺僅接受台積電官方網站投遞】 本職缺僅接受台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=567&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Investigator performs a number of job functions, including: 1. Information Leakage Case event investigation 2. Evidence collection 3. Witness interviews 4. Report writing 5. Record keeping 6. Case briefing for executive level review 7. Historical case summary, statistic, and analysis 8. Law Enforcement Liaison 9. Courtroom testimony

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=517&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Ideal candidates would have either a Master’s degree or a Ph.D. in computer science, information systems, information science or related fields. The responsibilities of this role include developing machine learning, deep learning, text mining, and/or network science-based approaches to extract insights from structured (transactional) and unstructured data sources.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=436&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 台灣積體電路製造股份有限公司(台積公司)致力於維護身心障礙者就業權益。依身心障礙者權益保障法, 特別規劃聘僱身障人才專區，歡迎領有身障手冊或證明者加入台積公司！ Responsibilities: 1. Process development and yield improvement. 2. Customer engagement 3. Design rule define, TV design, and technology qualification.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=532&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Front-end to back-end large scale digital circuit design for system-on-chips and 3DICs, responsible for designing with the state-of-the-art process technologies and developing corresponding CAD flows that explores cutting edge design methodologies and latest EDA tools, either for internal first-in-the-industry testchips or leading customer’s products