原相科技股份有限公司

1. FPGA Design and Integration 2. Analog Digital Interface Design and Intergration 3. Digital BIST Design and Plan Chip CP/FT/MT Testing

CMOS影像感測器之ADC,DAC,PGA,PLL等類比電路設計開發 1.研究所，電子、電機相關系所畢 2.對混合式訊號嵌入式設計有興趣 3.諳低電壓、省電、低雜訊之類比IC設計者尤佳 4.邏輯思考能力強、主動溝通、喜好腦力激盪與團隊合作者

1.具類比IC設計經驗 2.具ADC、DAC、PLL、High Speed Serial Link 等相關類比IC設計經驗者佳 3.諳低雜訊設計，具晶片整合經驗者佳 4.溝通表達能力佳，喜好腦力激盪，具團隊合作態度者

1.具類比IC設計經驗 2.具ADC、DAC、PLL、High Speed Serial Link 等相關類比IC設計經驗者佳 3.諳低雜訊設計，具晶片整合經驗者佳 4.溝通表達能力佳，喜好腦力激盪，具團隊合作態度者

1. FPGA Design and Integration 2. Analog Digital Interface Design and Intergration 3. Digital BIST Design and Plan Chip CP/FT/MT Testing

BT Control Layer BLE Link Layer Development and Maintenace

1. Development/Optimization of speech 2. Bio-medical signal processing 3. Noise suppression 4. Statistical Model(machine learning, bootstrap)

1. Mixed-mode SDM AD/DA, Audio Codec, and PLL circuit design 2. RF TX/RX FE and ADPLL circuit design 3. Power IC DC-DC Buck/Boost circuit design

1. Project維護及開發。 2. Design Verification, FPGA等驗證。

1. MCU FW driver porting/ 2.4G or BLE protocol develop. 2. 2.4G or BLE application develop. 3. RTOS 平台開發。 4. 具2.4G/BLE應用開發、驗證等經驗佳。 5. 具2年以上智慧手環/手錶/IOT相關韌體開發經驗者佳。 6. 熟悉SPI、I2C、UART者佳。 7. 精通 ARM Cortex, C, C# language。 8. 客戶端技術開發支援/debug。

1. Subcon management for Optical CSP associated package 2. new camera module development 3. IC 封裝相關經歷 – 製程整合 3 年以上經驗或封裝製程 3~5 年以上經驗 4. 具光學相關封裝經驗尤佳 IC封裝測試工程師在半導體產業中扮演著重要的角色，負責產品的測試、驗證、分析和異常處理。歡迎符合條件的人才申請本職缺，加入我們的團隊。

1. Work in Hsinchu or Taipei for Sales related works 2. Focus on CIS and automotive related fields 3. experience in forecast and shipping matters 4. Teamwork

Job Description • Design digital circuits for leading edge imaging sensor ICs • Develop Verilog/RTL architecture and write Verilog codes. Perform gate level and top level simulations. • Generate test benches for verification and set up regression-test suite. • Perform functional verification with FPGA (pre-silicon) and verify post silicon prototypes thoroughly. • Interface with various groups during the design cycle including system, analog and physical design teams. • Conduct thorough design reviews

1. 熟悉電容觸控相關演算法(like touch, noise and background calibration) 2. FPGA功能驗證 3 .開發電容觸控相關產測程式(C#) 4. 開發客戶端需求tool 5. 需支援解決客戶端FW問題 6. 熟悉I2C/PS2/HID 相關interface

Digital design flow development and maintenance。 1. Develop methodology for design automation. 2. EDA Tools maintenance. 3. Scripting utilizing Perl, TCL and C-Shell. 4. Document processes and flows.

1. 熟悉電容觸控系統設計與測試 2. 熟悉電容觸控IC內部硬體架構與韌體參數調校 3. 電容觸控IC與FPGA功能測試與驗證 4. 支援客戶系統設計與量產問題分析(須配合出差)

1. CIS System FT / CP 測試程式開發，H/W and Test Program 建置與 Debug 2. 協助測試廠量產導入 3. 開發影像Failure之測試演算法開發 4. 提升Test fault coverage，以降低DPPM. . 5. 量產Probe card/Load board 開發 6. 協助產品、封裝可靠度驗證之測試 7. 產品電性及Sensor Performance Characterization 8. 協助收集產品相關 datalog供設計與製程改善.

1. 負責RFIC/硬體相關驗証及相關系統開發。 2. 整合、測試無線通訊模組。 3. 有RF相關工程背景或無線滑鼠鍵盤開發經驗者為佳。 4. 主管交辦事項。

Job Description • Perform early concept proofing and evaluation to verify feasibility of new product definition for state-of-the-art image sensors • Develop algorithm for new products. Work closely with IC design team for implementation into silicon ICs. • Define design verification methodology and perform system verification tasks for new products/ICs. • Develop standard engineering hardware/software platform to support ICs’ design verification tasks. • Participate in reviews or support related to customer design-in or issues. • Image Processing or Algorithm development

Job Description • Responsible to perform engineering characterization for product development activities. Engineering characterization involves performing various electrical analysis such as voltage, temperature, process, material, ... etc. • Responsible to review the product performance distribution (results from above characterization) vs limits to ensure the product are fit to meet the target specification. • Define product limit in datasheet. • Work closely with the IC design team to develop new product test plan & test limits. • Lead the product failure investigation & improvement. • Lead and work closely with the Manufacturing team for yield improvement. • Responsible to provide recommendation / solutions / suggestion to customers to assist related product design-in activities and queries (supporting customer needs and application). • Work closely with Sales/Marketing in exploring new & potential product application.