力成科技股份有限公司

1.產品良率提升 2.製程參數優化 3.新產品導入 4.製程數據分析及改善 5.異常分析與實驗DOE Plan 6.新材料及製程評估及導入 * 研究領域與半導體先進封裝相關者或具有半導體產業實習經驗者尤佳 * 此為研發替代役應徵專用職缺，投遞前請確認是否符合114年度研發替代役資格。 * 實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。

Main work content: 1. Fan-out structure/ material/ process flow design 2. Fan-out RDL layout drawing review 3. Packaging direct material survey, evaluation, improvement & qualification 4. Design rule establishment & maintenance 5. Package failure analysis 6. Coordinate & lead project in design portion & co-work with process, integration & simulation teams 7. Direct communication with customers * 研究領域與半導體相關者或具有半導體產業實習經驗者尤佳 * 此為研發替代役應徵專用職缺，投遞前請確認是否符合114年度研發替代役資格。 * 實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。

執行Panel Level fan-out封裝專案開發、製程整合、良率改善及缺陷分析 詳細職責如下： 1.負責產品流程之整合規劃與製程流程最適化 2.產品良率提升及問題改善 3.定期與客戶報告產品進度及良率狀況 4.產品排程及品質管控及異常處置 5.擔任對內針對客戶相關訴求及產品相關需求之主要協調窗口 * 研究領域與半導體相關者或具有半導體產業實習經驗者尤佳 * 此為研發替代役應徵專用職缺，投遞前請確認是否符合114年度研發替代役資格。 * 實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip) 1.Package RFQ and structure & BOM selection. 2.Direct material evaluation and survey. 3.FA and Reverse Engineering. 4.Package design rule maintain & update. 5.Advance products design / NPI projects development. 6.Research & setup package roadmap / material roadmap.

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip) 1.Package RFQ and structure & BOM selection. 2.Direct material evaluation and survey. 3.FA and Reverse Engineering. 4.Package design rule maintain & update. 5.Advance products design / NPI projects development. 6.Research & setup package roadmap / material roadmap.

A. Package design 1. Package RFQ for cost estimation 2. New device package feasibility & technical risk assessment 3. Package structure, BOM design 4. Package design rule setup & update 5. Coordinate DR0 design review meeting 6. PKG structure confirmation after setup B. Package research & development 1. Research & setup package roadmap / material roadmap 2. New package development 3. New material survey & capability development 4. Setup direct material purchase specification 5. Technical benchmark with competitors (Reverse engineering)

1. Electrical package warpage and component stress simulation and analysis (FBGA, FCBGA, FOWLP, FOPLP, 3D IC CIS CSP, TSOP, QFN, QFP......). 2. Electrical package thermal simulation and analysis (JESD51 standard). 3. Electrical package mold flow and wire sweep simulation and analysis. 4. Board level drop test experiment and analysis (JESD22-B111 standard). 5. Warpage measurement by shadow moire (JESD22-B112 standard). 6. Database establishment and utility development. 7. New simulation capability development. ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

【Customer Engineering Account Management】 (1)Meet and exceed customer’s expectation of advanced package engineering in terms of quality, cost and delivery (2)Offer industrial leader’s advanced package solutions and services through integration of package and process development 【Project management】 (1)Project phase in schedule arrangement and follow up (2)SWR arrangement ,schedule follow up, negotiation…etc. (3)PKD/PMD creation (PLM) (4)Reliability arrangement 【Team Work】 (1)To optimize resource allocation (2)Enhance teamwork in 360° including customer, supplier and our colleagues (3)Develop self and others 1. 薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘； 2. 資深人員薪資另議。

【Customer Engineering Account Management】 (1)Meet and exceed customer’s expectation of advanced package engineering in terms of quality, cost and delivery (2)Offer industrial leader’s advanced package solutions and services through integration of package and process development 【Project management】 (1)Project phase in schedule arrangement and follow up (2)SWR arrangement ,schedule follow up, negotiation…etc. (3)PKD/PMD creation (PLM) (4)Reliability arrangement 【Team Work】 (1)To optimize resource allocation (2)Enhance teamwork in 360° including customer, supplier and our colleagues (3)Develop self and others

1. Customer Engineering Account Management -Meet and exceed customer's expectation of advanced package engineering in teams oof quality,cost and delivery. -Offer industrial leader's advanced package solutions and services through integration of package and process development. 2.Team work -To optimize resource allocation. -Enhance teamwork in 360。 including customer,supplier and our colleagues. -Develop self and others. 3. New product introduction 4. Implement and coordinate NPI plans 5. Process integration data analysis and reporting 6. Abnormal analysis and experimental DOE Plan 7. New materials and process evaluation plan ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。 　 　 　 　

1.SBT design. 2.SBT dwg & spec confirmation with supplier. 3.Research new EDA tool to enhance layout capability and efficiency. 4.Research SBT roadmap for new package design. 5.Maintain database of design drawing. ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

1. Marketing analysis and customer relationship management. 2. Take business opportunity and promote at customer site. 3. Define business direction based on PTI strategy and cost structure. 4. Contract review and price negotiation. 5. Well communication between customer and internal team. 6. Achieve monthly and annual sales target.

1.異常產品品質分析及良率提升 2.新產品(NP)工程品質改善/提升專案執行 3.IQC、OQC 4.撰寫8D report 5.客戶稽核準備與參與、內部稽核執行 6.需跨部門溝通(與研發、製程、客戶品質、設備等) ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

1.異常產品品質分析及良率提升 2.新產品(NP)工程品質改善/提升專案執行 3.IQC、OQC 4.撰寫8D report 5.客戶稽核準備與參與、內部稽核執行 6.需跨部門溝通(與研發、製程、客戶品質、設備等) ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

This position is responsible for resolving customer quality related issues and acting to resolve quality problems.This team will act as a key point of communication with customers on subjects as examples but not limited to customer complaints, customer requests. If have over 1 years quality related experience will be preferred. 【Key Responsibilities】 1.Customer claim and CAR disposition & follow-up. 2.Customer audit arrangement and finding follow-up. 3.Regular audit report preparation and meeting with customer. 4.Interface between PTI & customer on quality issue. 5.Strengthen customer relationship. 6.Satisfy customer on quality service. 【Problem Solving】 Recognizes and solves typical problems that can occur in own work area; evaluates and selects solutions from established options 【Interpersonal Skills】 Uses communication skills to exchange information; fluent English skill is perfect. TOEIC at least 600.

1.製程整合數據分析 2.產品良率提升 3.異常產品分析 4.客戶關係維護 5.其他跨組織合作之專案計劃 ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘 ＊資深人員薪資另議。

此為主管職職務，需帶領團隊，相關工作職責如下說明： 1. Keep good relationship with customer. 2. Focal channel and bridge between factory and customer. 3. Customer request transmitted & quickly feedback. 4. PCN management. 5. Excellent data and presentation material integration. 6. Project management well qrganized and satisfied with customer. 7. Customer urgent request supporting. 8. Line tour request supporting. 9. Engineering capability enhancement. ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘 ＊資深人員薪資另議。

1.主導ISO9001、IATF16949、VDA6.3等品質管理系統，並且執行、管理維護以及持續改善。 2.外來文件內容審核。 3.主導外部第三方稽核和車用客戶稽核，外部稽核安排以及稽核執行。 4.執行內部稽核與持續改善。 5.獨立規劃與執行跨部門專案，確保專案順利進行。 6.品質意識相關教育訓練規劃及訓練。 7.其他主管交辦之事項。 ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

本職務即為生產線幹部，為管理職，需帶領30~50位員工（台灣籍、菲律賓籍) 與學校課程中所說明的IE工程師(負責人機料法)相同、亦與製造工程師、帶線課長、儲備幹部等職稱為同樣職務。 此職務能給您豐富的產線管理經驗，強化問題處理、談判協商、資源統籌以及人機料法等實務能力，歡迎工管、企管、管理、理工科系相關背景新鮮人應徵挑戰！ 1. 投入產出管控，滿足客戶需求。 2. 人員出勤管控，工作安排，紀律督導，教育訓練。 3. 直/間材管控，降低生產成本。 4. 生產機台管控與安排。 5. 跨部門溝通協調解決生產問題。 6. 相關提高效率與降低成本專案分析研究報告。 7. 英文能力中等程度以上(需與菲籍同仁溝通、指派任務，並以英文撰寫相關報告) 8. 四班二輪，每三個月日夜輪調一次(視產線狀況有所調整) 日班：07:20~19:30(中間休息2小時10分) 夜班：19:20~07:30(中間休息2小時10分) *實際薪資依學歷、科系、相關工作經歷、專業證照、特殊專長與語言能力綜合核敘。 *資深人員薪資另議。

本職務即為生產線幹部，為管理職，需帶領30~50位員工（台灣籍、菲律賓籍) 與學校課程中所說明的IE工程師(負責人機料法)相同、亦與製造工程師、帶線課長、儲備幹部等職稱為同樣職務。 此職務能給您豐富的產線管理經驗，強化問題處理、談判協商、資源統籌以及人機料法等實務能力，歡迎工管、企管、管理、理工科系相關背景新鮮人應徵挑戰！ 1. 投入產出管控，滿足客戶需求。 2. 人員出勤管控，工作安排，紀律督導，教育訓練。 3. 直/間材管控，降低生產成本。 4. 生產機台管控與安排。 5. 跨部門溝通協調解決生產問題。 6. 相關提高效率與降低成本專案分析研究報告。 7. 英文能力中等程度以上(需與菲籍同仁溝通、指派任務，並以英文撰寫相關報告) 8. 四班二輪，每三個月日夜輪調一次(視產線狀況有所調整) 日班：07:20~19:30(中間休息2小時10分) 夜班：19:20~07:30(中間休息2小時10分) *實際薪資依學歷、科系、相關工作經歷、專業證照、特殊專長與語言能力綜合核敘。 *資深人員薪資另議。