光電及半導體生產設備
暫不提供
200人
新竹市科學園區篤行路6-6號1樓
威科儀器是具有30年歷史的美國那斯達克上市公司 (NASDAQ: VECO),總部位於美國紐約州Palinview. 多年來,我們始終聚焦在研發生產最尖端的半導體製程設備。為確保技術和品質的一致性,我們堅持在美國完成絕大部分的研發和生產,而亞洲是我們除了美國之外最重視的市場,我們最菁英的業務和工程服務同仁也持續在在地市場壯大、精進。 Veeco is a US-based multinational company, Nadaq: VECO. Veeco designs, manufactures and markets thin film process equipment that enables high-tech electronic device production and development all over the world. Making a Material Difference is at the core of our DNA. For more than 30 years, we have developed differentiated technologies and built expertise and know-how that has enabled world-changing devices such as LED lighting, data storage, advanced computing and mobile devices to reach industrial scale. We help customers overcome technical and cost barriers that make it possible to convert novel materials into high-yielding device performance at production volumes. Our customers produce the newest, fastest, smallest, and most efficient electronic components used in devices to help deliver a better world. We serve the semiconductor and emerging high-growth markets. Our process equipment and technology are used to manufacture advanced semiconductors, LEDs, displays, photonics, VCSELs, power electronics, compound semiconductors, hard disk drives, MEMS and wireless chips. Veeco's proven metal organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) lithography, laser spike annealing, ion beam, single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays and in the fabrication of power electronics, photonics, optics and advanced semiconductor devices. The company also offers solutions to the semiconductor wafer inspection market that leverages proprietary coherent gradient sensing (CGS) technology, and provides atomic layer deposition (ALD) tools to leading research organizations. More information please go to company website: www.veeco.com
光電及半導體生產設備 - Metal organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) lithography, laser spike annealing, ion beam, single wafer etch and clean technologies.
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