世界先進積體電路股份有限公司

系統工程師： 1.常日班 2.主要負責廠務機電、空調、CR、空污 or 冰水系統、冷卻水系統負責人 3.廠務工程規劃、發包、監造、及驗收作業 4.系統問題的預防對策及持續提出改善方案 值班工程師： 1. 四/二輪班工作。 2. 電力/空調系統運轉維護。 3. 電力/空調系統異常處理。 4. 電力/空調系統擴充及改善。 5. 潔淨室環境監測系統維護。 6. 支援專案工作執行。

1. To engage business by value-selling with NTO and loading opportunities which needs more time to proliferate current & new customers , based on technology platforms, like BCD, eFlash, MEMS, GaN, SG discrete ( w/ BGBM turn-key). 2. To win more projects from Fabless & IDMs, especially for large geometry IC & SGT discrete opportunities. 3. To penetrate more PMIC Fabless customers in China & Japanese IDMs for new business model & new projects.

(1).開發及維護製造資訊管理系統，具平台開發經驗佳。 (2).廠區生產力(Tool/People)智能製造專案需求分析與流程設計。 (3).具跨部門溝通協調能力。 (4).協同CIM進行系統開發，測試與上線。 (5).熟悉Oracle SQL、程式coding(ASP/VBA/Python佳)。

1. 新產品導入與開發 2. 量產產品問題解決與改善 3. 執行上一級主管交辦事項

1.負責 eFuse IP 與 eFuse Testchip 之設計開發; IP Design kits 產出與 Silicon驗證工作. 2.負責 OTP (One-Time-Program) IP 與 OTP Testchip之設計開發; IP Design kits 產出與 Silicon驗證工作. 3.負責 MTP (Multi-Times-Program) IP 與 MTP Testchip之設計開發; IP Design kits 產出與 Silicon驗證工作. 4.熟悉類比電路設計, eg: Charge Pumping; Bangap Reference; DLL; MBIST; ECC…等 Functional Blocks.

專長：Lam9400 /TEL DRM 等設備專長 工作內容： 1. 領導團隊達成生產目標及上級交付任務 2. 透過改善，維持及提高機台產能 3. 協助良率提升、生產力提昇及降低生產成本 4. 設備異常之處理及解決、機台維修保養及改善 5. 工作地點：新竹、桃園

工作內容： 1. 領導團隊達成生產目標及上級交付任務 2. 透過改善，維持及提高機台產能 3. 協助良率提升、生產力提昇及降低生產成本 4. 設備異常之處理及解決、機台維修保養及改善 5. 工作地點：新竹

1.Discrete 新製程評估、建立及導入。 2.元件電性分析及異常改善。 3.維持新產品量產。 4.建立與客戶及開發夥伴之良好互動，了解客戶需求，解決客戶問題。 5.其它主管交辦相關業務執行。

1. 四/二輪班工作。 2. 電力/空調系統運轉維護。 3. 電力/空調系統異常處理。 4. 電力/空調系統擴充及改善。 5. 潔淨室環境監測系統維護。 6. 支援專案工作執行。

1. New module development 2. Coordinate 4 modules PRS activity and ensure robustness.

1. 負責DIFF 製程開發和最佳化，以滿足產能、品質、良率需求 2. 與團隊跨部門合作，推動製程的開發、控制和改善 3. 維持日常運作並解決問題 4. 主要機型為KE/TEL/AMAT/SMIT

1. 海內外招募專案 2. 中高階及關鍵人才招募 3. 校園關係管理 4. Account人員招募 5. 系統專案之規劃與執行

1. Strong high-tech industry knowledge and experience 2. Skills and experience in market research and analysis 3. Strategic and strong business acumen 4. Modelling capability and business sense 5. Effective conflict resolution and active listening skills 6. Capacity to thrive independently in a fast-paced environment 7. Preferred: MS degree in Engineering, with MBA as a plus or vice versa 8. 5+ years of experience (automotive is a plus) 9. Fluency in both written and spoken English and Mandarin

1. Provide sales and account management support to new and existing customers. 2. Prepare quotation and negotiate with assigned customers’ requests and/or opportunities. 3. Interface with customers to fully understand their technical requirements, including product specifications and roadmaps. 4. Bridge customers’ support needs with internal support teams to provide timely and accurate answers, solutions. 5. Promote company’s technologies and be proactive with up-selling and cross-selling opportunities. Support and participate in Business Development related activities, as needed. 6. Support revenue growth in North America, covering all key semiconductor applications and market trends (existing and emerging).

1. Take charge of facility gas/chemical package concept design and RFP Preparation for 300mm semi-conductor Fabrication plant. 2. Supervise and monitor EPC contractors or design consultants’ design progress. 3. On-site management MEP package construction schedule and commissioning. 4. Need to travel overseas to support setup facility system for 1 ~2 years.

1. Take charge of facility MEP package concept design and RFP Preparation for 300mm semi-conductor Fabrication plant. 2. Supervise and monitor EPC contractors or design consultants’ design progress. 3. On-site management MEP package construction schedule and commissioning. 4. Need to travel overseas to support setup facility system for 1 ~2 years.

1. Take charge of facility CIVIL&MEP package concept design and RFP Preparation for 300mm semi-conductor Fabrication plant. 2. Supervise and monitor EPC contractors or design consultants’ design progress. 3. On-site management CIVIL&MEP package construction schedule and commissioning. 4. Need to travel overseas to support civil construction for 1 ~2 years.

1. Take charge of facility MEP package concept design and RFP Preparation for 300mm semi-conductor Fabrication plant. 2. Supervise and monitor EPC contractors or design consultants’ design progress. 3. On-site management MEP package construction schedule and commissioning. 4. Need to travel overseas to support setup facility system for 1 ~2 years.

1. Take charge of facility FMCS package concept design and RFP Preparation for 300mm semi-conductor Fabrication plant. 2. Supervise and monitor EPC contractors or design consultants’ design progress. 3. On-site management FMCS package construction schedule and commissioning. 4. Need to travel overseas to support setup facility system for 1 ~2 years.

1. Take charge of facility water treatment (UPW & WWT & Water recycling…) system package concept design and RFP Preparation for 300mm semi-conductor Fabrication plant. 2. Supervise and monitor water treatment contractors or design consultants’ design progress. 3. On-site management water treatment package construction schedule and commissioning. 4. Need to travel overseas to support setup facility system for 1 ~2 years.