台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)

加入美光，開啟職涯新篇章！ 我們正積極推廣非傳統途徑的招募管道（Non-Traditional Pathway，簡稱NTP）。這個計畫的目標是吸引過去完全沒有半導體相關工作經驗，或是職涯中斷一年以上但過去具備半導體經驗的人才。無論是對於跨領域學習充滿熱情，想轉職進入半導體產業，或是希望重返職場，美光將為人才提供全新的機會。 我們希望打破過往人才招募上的許多框架，透過提供專業的訓練課程，幫助有意轉職或重返職場的人才提升軟實力和硬實力，讓人才能夠順利進入半導體產業，並有機會加入美光。我們正在與外部機構合作，開設相關課程及舉辦工作坊，讓更多優秀及多元的人才有機會加入我們，實現自己的職業夢想！ 跨領域轉職 青年前進半導體工作坊 (新計劃即將開始) • 活動時間：2025年5月 • 活動地點：逢甲大學 • 募集對象：大學文商科即將畢業或畢業2年內新鮮人 • 培訓費用：免費 課程A：半導體設備工程師培訓班 (已結訓) • 開課時間：2025年1月13日 - 3月11日, 每週一至週五 9:00-16:00 • 上課地點：逢甲大學 • 課程內容：半導體產品製程介紹、設備維護與應用、企業參訪等 • 募集對象：大學以上 • 培訓費用：免費 課程B：半導體設備工程師培訓班 (已結訓) • 開課時間：2025年2月17日 - 3月26日, 每週一至週五 9:00-16:00 • 上課地點：逢甲大學 • 課程內容：半導體製程與設備介紹、機械工程概論、企業參訪等 • 募集對象：大學以上 • 培訓費用：免費 二度就業 線上工作坊：加入美光封測廠HBM (High Bandwidth Memory) 的設備助理工程團隊 (新計劃即將開始) • 活動時間：2025年5月 • 活動地點：ZOOM meeting • 募集對象：大學以上，維修領域的專業人士，以及目前離開職場超過一年 • 培訓費用：免費 工作坊：共創未來，職場新篇章 • 活動時間：2025年1月8日 - 1月9日, 週三和週四 9:00-16:00 • 活動地點：逢甲大學 • 課程內容：職場溝通、問題解決能力、團隊合作等 • 募集對象：大學以上，且已離開職場超過一年 • 參加費用：免費 招募資訊 • 工作地點：台中中科后里園區/桃園林口華亞科技園區 • 工作類型：全職工作 • 薪資：面議 • 招募職類：工業工程、生產製造、設備工程、製程整合工程、資訊工程、品質工程、廠務工程、封裝與測試工程、研發工程、採購、供應鏈、會計、人資、助理工程師、技術員等 • 招募對象：(1) 已離開職場超過一年的二度就業求職者 (2) 欲跨領域轉職加入半導體產業者，經歷不拘。歡迎主動投遞履歷，符合資格者我們將由招募人員為您推薦合適的職務。 立即報名 https://micron.wd1.myworkdayjobs.com/en-US/External/job/Micron-Taiwan-2025----_JR73021

Micron 身心障礙人才就業媒合專區 (工作地點:台中后里廠區) 1. 不限身障類別、程度，需持有身障手冊 2. 學經歷: 學士以上、工作經驗不拘 只要對美光有興趣，歡迎您主動投遞履歷，將有專人根據您專長為您媒合最合適您的職缺!! 美光看見您的未來：熱烈歡迎、大力徵求想拓展全球視野、體驗外商文化的您加入美光！ ◆歡迎推薦身心障礙朋友投遞本公司履歷◆

Micron 身心障礙人才就業媒合專區 (工作地點:桃園龜山廠區) 1. 不限身障類別、程度，需持有身障手冊 2. 學經歷: 學士以上、工作經驗不拘 只要對美光有興趣，歡迎您主動投遞履歷，將有專人根據您專長為您媒合最合適您的職缺!! 美光看見您的未來：熱烈歡迎、大力徵求想拓展全球視野、體驗外商文化的您加入美光！ ◆歡迎推薦身心障礙朋友投遞本公司履歷◆

Apply here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/DEMQRA-HBM-EFA-Engineer_JR54060 As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology, Inc., we are responsible for the electrical characterization and EFA of all HBM product types. We will need to distinguish its package related failures or device related. We need to have DRAM functionality, process, test program and device knowledge to make the judgment. We will also use a variety of test tools including the testers, Probers, CAD layout tools, and a couple of technical drawings and schematics to perform detailed characterization. In this role we will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain an EFA database. Responsibilities and Tasks Analyze Failed Components from Reliability Testing • Interpret historical test results • Adjust timing/level/testmode/code/temp to find out the sensitivities of failures for array fails • Perform visual inspection to identify physical defects • Schematics/layouts/process to recognize abnormalities • Document failed conditions and test results • Categorize electrical failures • Identify and communicate new or unusual results (electrical signals) Respond to Equipment Issues • Understand test configurations • Identify and report issues • Repair or coordinate repair of equipment • Configure and upgrade test equipment • Develop and deploy failure analysis (FA) software Provide Technical Support and Conduct Training • Settle hardware setup and equipment / operator ratio • Instruct operation of equipment • Conduct on-the-job training (OJT) for new hires and transfers • Provide data interpretation • Suggest failure root cause • Provide suggestions for further analysis • Introduce new users to basic DRAM functionality/process/device Perform Engineering Requests and Supplemental Tasks • Submit package level physical failure analysis (PFA) • Provide FA for other groups as requested (RMA, Module) • Resolve engineering test requirements Handle FA Information • Build and maintain specific FA database • Review FA data • Identify false failures • Analyze and summarize data Perform Quality/Reliability request and review • Test time reduction requests • Design/Marketing datasheet requests • Modify Qual requests • Material Review Board (MRB) • Customer reports/data Education • Bachelor/ Master's degree or equivalent experience • Electrical Engineering, Electronics or related field of study Experience Experiences in each of the following: • Failure Analysis • Debugging (C Language, Python) Qualifications • Good interpersonal skills and sharp attention to detail • Excellent verbal and written communication skills • Knowledge of the DRAM fabrication process/test program/functionality • Familiarity with Unix, DFII/Cadence related testers such as ATE & uM3. • Ability to use the analytical tools provided on the various test equipment, such as Micromate, Curve Tracer, or Oscilloscope

Apply here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/Global-Quality---DRAM-and-Emerging-Memory-Quality-and-Reliability-Assurance--DEMQRA--Engineer_JR70936 As a Global Quality DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) Engineer at Micron Technology, Inc., we will be the DRAM Product QRA lead responsible for Micron DRAM product quality. Our responsibilities will include product qualification, deviation material disposition, Outgoing Quality & Reliability management, and customer DPM monitoring. We will drive DPM reduction, quality improvement experiments, and enable customer DPM to reach Best In Class (BIC). We will be a Subject Matter Expert (SME) on stress failure risk assessment and failure countermeasures. Familiarity with Micron Probe, Burn, TEST, and Module Flow is essential, and we will be the go-to expert when failures or RMAs occur and test coverage is in place. We will closely collaborate with Micron FAB, ASM, TEST, DEG, PYE, PDE, Supply Chain, BU, GQ, FAE, Site QE, and worldwide cross-functional teams to resolve any Product Quality and Reliability Issues.   Responsibilities and Tasks: New Product Qualification: • Provide new product qualification plans, review, and release product releases. Quality Monitor Flow Setup and Quality Maintenance: • Define outgoing quality and reliability sampling and test plans. • Monitor FAB, ASM, Components BE TEST, and Module TEST results to ensure the product meets customer expectations. • Perform data mining and correlation of all inline test data for failure/RMA. Identify root causes and drive corrective/preventive actions. • Deep dive into qualifying failure reasons, analyzing FA results, process structure, circuit schematics, and test patterns to understand the root cause of failures. Collaborate with FAB, TEST, ASM, PYE, and DEG to implement countermeasures when quality and reliability fallout is observed. • Set up quality and reliability improvement DOE and establish results into production. Manufacturing Support: • Act as the decision-maker for MRB deviation materials disposition. • Implement inventory reduction, rescreen, and rework to minimize the cost of non-conformance. • Provide technical support for risk assessment when a quality risk review is called from the Supply Chain, MFG. • Provide guidance to MFG for execution when quality issues occur in manufacturing. Customer Engagement: • Review internal quality metrics and drive product improvement for customer DPM to Best In Class (BIC). • Support customer RMA and address questions/requirements. Reliability Methods: • Implement wafer-level Burn-In, package burn-in, stress flow monitoring, and stress time determination. • Act as a stress DPM calculation expert.    Education: • Bachelor’s Degree in Electrical Engineering, related field of study, or equivalent experience.   Experience: • Desired experience in each of the following: • Semiconductor Manufacturing, • Product QRA, • Product Engineer, • Test Solution Engineer, • Yield Enhancement Engineer   Qualifications: • Strong troubleshooting skills • Good organizational skills and sharp attention to detail • Good written and oral communication skills • Efficient computer skills • Knowledge of DRAM operation and fabrication process • Knowledge of DRAM probe bin, BE, and module testing concepts and flow • Knowledge of using statistical tools, Unix, Tableau, JMP • Familiarity with Unix and/or ATE (Auto Test Equipment) preferred • Ability to work independently or in a group environment • Basic understanding of electrical equipment • Familiarity with languages such as JavaScript, Python, shell scripts

Job Description As a advanced package engineer in Micron’s Advanced Packaging Technology Development (APTD) group at Taiwan Taichung, you will be responsible for process development with integration scheme for memory devices application. In this position, you will work with process module team, data science team, defect team to develop unit processes that meet product spec and device requirements for HBM products. Additionally, real time yield and defect analysis, inline WIP control and escalate for any potential issues are needed. RESPONSIBILITIES: • Yield and quality improvement for HBM products to support product milestone deliverables. • Develop and lead integration processes from the conceptual phase to high-volume production for highly complex package development challenges. • Work closely with multiple cross functional teams including defect team, probe testing team, and process module team. • Able to work independently along with various projects inside of APTD team. Basic Qualifications: • Bachelor’s degree in physics, chemistry, electrical engineering, mechanical engineering, material science, or other applied engineering discipline. • Have knowledge on semiconductor packaging process including assembly, bumping and / or RDL process. • Understanding on technical risk assessment, setup mitigation plan, FMEA, and SPC. • Verbal and written communication skills in English

Apply Here: https://micron.wd1.myworkdayjobs.com/zh-TW/External/job/Taichung---Fab-16-Taiwan/DRAM-Product-Test-Development-Engineer_JR39671 We are looking for a collaborative and optimistic individual with a growth mindset who will help us develop, optimize, and enable the test program and other test solutions for upcoming LPDDR6 and other low-power DRAM. LPDRAM testing will require innovative solutions and strategies to guarantee quality while optimizing yields and capacity. Job Responsibilities: • Design, develop and maintain tests and program code for Automated Test Equipment (ATE) running Mobile devices. • Develop a strong understanding of the manufacturing flow from wafer to package, tested products’ native operations, ATE hardware capabilities, and customer application. • Collaborate with local and global test engineering, product engineering, and other network partners. • Assist with strategy and ongoing test development for upcoming LPDDR6 • Leading test development activities for new product introduction through the entire product lifecycle. • Drive for high quality, yields, and capacity through manufacturable test solutions Requirements: • Bachelor’s degree in electrical, computer engineering, or computer science • Proficiency in English and Chinese; Japanese is a plus • 3-5 years of professional experience in Python or C/C++; Basic skills with Linux or Unix • 3-5 years of experience in semiconductor manufacturing in a product engineering or test development role (wafer or package); DRAM is a plus • Good verbal and written communication skills • Strong in logical problem solving; Proactive and self-driven for results

Identify, select, and evaluate new equipment/ new technology to support current and future requirements - Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap - Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements - Work with equipment suppliers to develop new capability - Engage in active participation in Package Development Engineering activities - Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need - Create decision matrix for equipment and material selection   Installation and qualification of new equipment platform and handover to production group - Plan/submit capital request to acquire new Equipment - Create purchasing specification (Doc2) document - Establish the new equipment qualification criteria and activities roadmap with respective functional - team - Establish project handover requirements and procedures upon machine qualification - Prepare documentation for handing over with respective site owner - Conduct data gathering for low volume production - Conduct training for Site representatives - Feedback loop for Continuous Improvement after mass volume production Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform - Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level - Maintain and regularly update the TOR, with inputs from local or other assembly site - Maintain general knowledge of process and material characteristics and translate to equipment design requirement - Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need Collaborate with production group on upgrades of existing production equipment through continuous improvement projects - Maintain knowledge of design constraints and weakness of existing platform - Participate in the continuous improvement projects involving equipment improvement and upgrades   Job Requirements/ Qualifications:  - PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required  - Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques - Minimum 3 years’ experience in related semiconductor industry - Experience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology - Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus  - Fast learner, with initiative and independence (min supervision) - Good team player, ability to integrate and cooperate with cross function teams and external vendors - Strong communication and presentation skills  - Understanding of business needs and customers’ requirement  - Strong project management skills to ensure execution to timelines 

Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/Sr-Engineer--Packaging-Technology-Development-and-Integration_JR41649 【Job Responsibilities】 • Ensure smooth transition from new process development, 1st qualification success to small volume production launch Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode (NPI) requirements and schedule Perform process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. Lead/collaborate with cross function team/site, to ensure successful transfer to CEM for LVM. Qualify new process/technology/equipment/materials Implement PMI (Process Maturity Index) methodology & provide proper Documentation for product transfer CEM & HVM • Technical capability Identify path finding opportunities for continuous yield improvement and cost reduction activities To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance. Provide new solutions on time to meet company and customer needs Define, develop and establish process capabilities, strategy and roadmap To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements. 【Job Requirements】 PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required 2 years' experience in semiconductor industry Experience in Frontend fab Process integration or Module process with technical knowledge on wafer and die level process technology Understanding of Micron’s silicon and how it interacts at backend process & package level through CPI is a plus Strong project management skills to ensure execution to timelines Strong communication and presentation skills Understanding of business needs and customers’ requirement Ability to integrate & cooperate with people from cross function teams

Job Description As a PDE Metrology/RDA Engineer at Micron Technology, Inc., you will be responsible for facilitating improvement of manufacturing capability, executing global business processes, and enabling the leverage of world-wide resources to deliver Best-In-Class performance. Your objective is to drive global peer groups to align and optimize manufacturing performance, which will include involvement in resolving tactical issues. Execute to this by focusing on manufacturing big rock performance gaps (metrics) and leverage the global network to define solutions that can be driven across all sites. You will work with your customers on benchmarking these metrics to improve performance in the Micron Backend. This position requires significant exploratory work in supporting the TD development to characterize the process by supporting engineering recipe in various metrology and inspection workstation. Additional responsibilities include the knowledge and use of statistical tools and concepts to ensure the quality of measurement/inspection data generated and the requirements needed of the Metro/RDA TOR. This position requires interfacing with Tech Development Engineering team, Global and Site Quality, Central Engineering, Global Purchasing and Planning groups to review and evaluate manufacturing changes. You must be willing and capable of effective collaboration with your partners and customers. You must also be willing and capable of international travel, as needed, to accomplish your objectives. Responsibility Support Metro/RDA MTEP Evaluation, Decision Analysis, develop and manage projects designed to reduce cost, improve throughput, reduce tool measurement variability, and perform research and develop new metrology capabilities to improve detection capability Partner with the metrology/RDA tool vendors to develop new hardware, software, and technologies related to recipe and hardware performance improvements Responsible for inspection & measurement recipe development We work closely with different teams to understand any relationship across defense line and feasibility of shift left activities. Analysis correlation between wafer fabrication parameters and backend manufacturing issues to identify opportunities for gap closure, and work with process integration team to reach a resolution. Establish and define Metrology/RDA Business Process Develop methodology for Metro/Inspection Data Continuity across all metro/RDA steps Establish Recipe Setup (POR) and Change Protocol for all Metro/RDA workstations types Python, Tableau, PowerBI skillset will be a great value to this position Hands on in recipe development for inspection and measurement workstation such as KLA, Rudolph, Nordson, CAMTEK preferred Good data analysis, statistical analysis, data interpretation skills to support the product development work

【Responsibilities and Tasks】 • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement.

Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---MTB-Taiwan/PDE-HBM-NPI-Sr-Assembly-Engineer_JR56744 Job Description As package NPI process engineer, you will experience in many processes that requires fine tuning, modification, flow change, machine upgrade, yield improvement, CIP, case analysis Day to day routine, production line general issues handling. project leading, mostly is yield improvement, process turning, cost reduction, material change, recipe fine tuning Working flow optimization, better to be familiar with SOP/ECRS/PDCA and TPS (Toyota production system) and lean production Good in English presentation and communication to convince people to accept new concept to work Requirement: Good in working with people, not just data analysis, reporting. Open mind in many things, not to be limited by old mindset. Able to run activities for months, persist for what is right thing to do but meanwhile, not to be aggressive to sell the idea.

Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---MTB-Taiwan/PRINCIPAL-ENGINEER--HBM-TSV-ASSEMBLY-LEAD_JR41547 【Job Description Summary】 As a Principal Process Engineer you will be primarily lead for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives. • Align to Company and R&D policies, strategic objectives, goals and priorities. • Adhere to Company ethic and code of conduct Contribute to attain and maintain required certifications (Quality, Environment, Safety and Health) • Contribute to a Safe and Compliant Work Environment - Identify and promptly report hazards - Follow safety procedures and area work rules (including use of proper PPE, energy isolation, and chemical safety) • Follow and implement established policies. Contribute to achieve strategic objectives & goals based on priorities. Develop patent disclosure attitude. Develop and protect Micron’s intellectual property. • Individual competencies and technical expertise development. -Readily seek assistance when skills are in question. -Read relevant literature for deeper understanding and insight and apply it on research projects. -Continue learning through appropriate internal/external classes as applicable. -Continue learning "on the job". -Understand devices physics and behavior. • Communications and teamwork -Prepare and present data and reports to management and peers. -Favour teamwork through flexibility and positive attitude -Organize materials and data to be presented during meetings and actively participate to meetings. • Process Engineering General: -Coordinate and execute process equipment and material evaluation / Optimization initiatives and implement changes at process steps. -Lead / Participate in continuous yield improvement and cost reduction activities. -Qualify and Implement New Product, Process, Equipment and/or Material. -Validate and fan out new process baseline qualified. -Handle the NPI runs to meet the schedule of business cases/ new product introduction. -Assembly’s qualification procedures and reports -Define operation procedures Create the process recipes. -Create and implement the DoE. -Ensure materials compatibility with equipment and parameters. -Verify the machine capability to fulfill the requirements of new products - Evaluate and Improve Assigned Assembly Manufacturing Processes, Materials, and/or Equipment. -Optimize process and ensure the process capability (CpK) -Determine root cause and implement corrective actions if any abnormality is found Evaluate/ Introduce New Process, Equipment, Material Technologies -Locate and research technical information on equipment, materials, and/or processes in journals, literature, web, etc -Identify supplier’s materials or equipment design and production processes. -Introduce new materials, equipment to fulfill the requirement of new products. -Create decision matrix for equipment and material selection. -Develop Process of Record (POR) and Tool of Record (TOR) Coordinate Training Requirements and Conduct Training -Develop, or coordinate development of, training materials for new processes/ machines. -Conduct training for production trainers train and mentor others.

Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---MTB-Taiwan/HBM-Engineering-Technician_JR67080 Responsible for monitoring tool performance and scheduling and performing preventative maintenance on your assigned area's equipment. Use mechanical and electronic skills to troubleshoot and repair down equipment. Assist with equipment installs and upgrades and create and modify equipment procedures. Work to increase tool uptime through systematic problem-solving and troubleshooting, quality workmanship, and routine reviews of maintenance checklists and procedures. Supports engineering activities such as design, test, check-out, modification, fabrication, and assembly of prototype electro-mechanical systems, experimental design circuitry, or specialized test equipment. Applications may include analog, digital and/or video circuits and logic systems. Works from schematics, diagrams, written, and verbal descriptions, layouts or defined plans to perform testing, checkout, and trouble-shooting functions. Performs operational test and fault isolation on systems and equipment. Assists in determining methods or actions to remedy malfunctions. Assists in the design, construction, test, and check-out of test equipment. Uses manufacturing, test, development, or diagnostic equipment, including, but not limited to, test programs oscilloscopes, signal generators, and specialized test apparatus. Requirements: • Diploma in Electronics/Mechanical/Electrical/Mechatronics Engineering . • Interest/Experience in semiconductor and testing environment . Experience: • 2-5 years related-experience desired. New College Graduate is also welcome .

Job Description Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement.

Apply here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/Product-Yield-Enhancement--PYE--Engineer_JR42813 As a Product Yield Enhancement (PYE) Engineer for Micron Technology, Inc., you will work with a team responsible for taking next generation devices from design to mass production. You will focus on failure analysis of test, internal qualification, and RMA failures, allowing for enhanced product reliability, rapid production ramp and early time to market. Your primary areas of responsibility will utilize fault isolation with a combination of electrical and physical characterization techniques combined with data analysis to identify physical defects introduced by process level or assembly step. Additionally, you will be responsible for communicating and coordinating failure analysis findings with Management, Product, Process, Assembly and Quality Assurance groups. 【The general responsibilities of the position are the following】 • Perform Electrical Failure Analysis and Fault Isolation • ​Operate uMate bench test platform • Operate Hamamatsu iPHEMOS, Thermo Fisher ELITE and other photon, thermal, or laser stimulating emission tools • Characterize or model backend test, internal qualification, and RMA fail signatures • Extensive understanding of physical and logical semi-conductor design • Use layout/schematic to aid in fault isolation and fail signature modeling • Understand various PFA and de-processing techniques for failures • Understanding Fabrication Process and Package Assembly • In depth understanding of CMOS process fabrication levels, steps, and methodologies • Knowledge of the steps and details involved in the package assembly flow • Understand reliability concerns that can cause delayed breakdown fail signatures • Extensive expertise with process and assembly related defects as well as their causes and effects • Provide Clear and Comprehensive Fail Signature Information • Understand probe, backend test and qualification flows • Generate organized and timely failure analysis reports with clearly communicated causes and effects • Perform fab, probe, and backend data extractions to provide supplemental data 【Successful candidates for this position will have】 • Excellent problem-solving and analytical skills • Strong grasp of concepts regarding thorough investigative procedure • Computer aided layout and schematic experience • Semiconductor process coursework and/or experience • UNIX and Programming experience • Experience working in teams and ability to work well with others • Solid GPA • Course work in VLSI design and semiconductor device physics (Preferred) • Good communication skills • Self-motivation and enthusiasm 【Education】 • Bachelor’s or higher Degree in Electrical or Computer Engineering

Do you want to be part of a team that drives business and builds powerful software solution with modern technologies? Do you hope to own the works which can add your innovative ideas in application design? We are the software development team is focusing on global solution development in AT. Our team is AT ADS which is Assembly and Test Application Development & Support team. When you join in our team, you are part of our agile teams to collaborate with worldwide teams to deliver business values in Micron. We care our member's development and career path and our team members are always willing to share the skills and findings to the team. The benefits are not only team can learn quickly but also detail the knowledge for the team's development. The members who join us have the growth mindset and also welcome the challenges. Are you curious about how the applications/webs develop? As an IT Software Engineer in AT ADS, you will be familiar with the skills on development, configuration and operation support for Micron In-house and the 3rd party applications. You will build and analyze software specifications, research, design, document and support software throughout the development life cycle. You must demonstrate the functional and technical skills vital to switch between development technologies and merge them to provide the innovative solution. You must have a consistent track record to build quality software and participate in quality improvement efforts. You will provide the solutions that build business values while at the same time minimizing negative impact through defects, downtime, or performance degradation. Responsibilities: • Analyze business needs to identify the problem. Collaborate with others (Business Analysts, Product Owner, Project Managers...) to identify, clarify, and capture business requirements. Document as is and To Be process flows. • Evaluate the available software options. Co-work with the architect team to design a craft solution with high quality which is aligned to our IT roadmap. Be encouraged to work with team and leaders in a decision analysis. Collaborate with the Scrum Master to work out the estimated dev. time, resource constraints, etc... Complete unit testing. Participate with end users in integration and user acceptance testing. Document (technical specifications, test plans, deployment plans, etc.). Implement 3rd party solutions. • Supporting operation cases to tackle the impacts in manufacturing. Provide 24x7 IT support for software issues, with arrangement (via on-line, on-call… model) when vital to lead to resolve worldwide case(s). Respond to customer or developer requests for assistance. Tackle issues independently and with other teams. Qualifications & Skills: • Familiar with OOP, C#, C++, Angular JS, Javascript, Web technologies, Git, Solace, OpenShift, Database, Unit Test, Linux is preferable. • Good communication and collaboration skills • Good skills on problem solving and analysis Education and Experience: • Bachelor degree(or above) major in Computer Science or Computer Engineering or related fields. • Fluent English ability • Experience in software development in Semiconductor will be preferentially considered.

Apply here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---MTB-Taiwan/SENIOR-LEAD-Au_JR43522 As a Quality Management Office (QMO) Auditor at Micron Technology, we will be responsible for preparing, supporting, and conducting internal audits and hosting or supporting external quality audits (customer and certification). We will be required to work with Micron departments and leaders to develop schedules, review documents and procedures, gather and evaluate information related to quality, and summarize and report findings. 【Plan Audit, Objectives and Schedule】 • Assist with the development and maintenance of Internal Audit Schedule (System, Process, and Product Audits), customer and certification audit schedule • Gather information from production, service, development and supporting activities and perform assessment to identify risk areas to be focused during the audit • Analyze department quality systems and previous audit information from multiple sources • Lead Auditor: assist with audit team selection and audit plan preparation for internal audits • Represent the audit team with management of the audited area, with customers and certification body 【Conduct Quality Audits】 • Perform internal quality audits (System, Process, Product Audits and special audits as required by the organization) and identify value added non-conformity, strengths, and opportunities for improvement • Lead or support special audits required by management upon need • Analyze findings and summarize them for presentation or report with the final objective to enable organization to improve processes • Facilitate closing meeting to review and interpret results with management • Follow up on audits to ensure that solutions/actions are implemented to fulfill the requirements and avoid recurrence • Assist, when needed, for determination of action plan to solve non-conformities 【Host external Audits】 • Coordinate audit schedule • Help in preparation, including the line tour and dry run when needed • Participate to audit on site • Facilitate, when needed, closing meeting to review and interpret results with management • Support post audit follow-up • Ensure audit team follow up on audits to enable solutions/actions that once implemented fulfill the requirements and avoid recurrence • Analyze findings and summarize them for presentation or report with the final objective to enable organization to improve processes • Assist, when needed, for determination of action plan to solve non-conformities • Be the auditee for Manage Quality Audit process • Support Improvement of the Quality Management System through assessment and sharing best practices and participating in quality improvement projects • Maintain Knowledge and Awareness of auditor skills and competences 【Required Competencies】 • ISO9001:2015 and IATF16949:2016 • VDA 6.3 version 2016 • Automotive Spice • Automotive Core Tools (FMEA, SPC, MSA, APQP, PPAP) • ISO9001 and IATF certification rules • Prior experience in internal, customer and certification audits • Automotive process approach for auditing incl. risk-based thinking • Understanding of applicable customer specific requirements • Understanding of semiconductor manufacturing processes and product requirements • Ability to work under tight timeframes and prioritize competing activities • Excellent organizational and management skills and outstanding interpersonal and teamwork skills • Strong verbal and written communication skills • Ability to collaborate within team and with cross-functional teams to understand needs and translate them into actionable plans, deliverables, and resource requirements • Good multi-tasking and problem solving skills • Technical understanding of semiconductor manufacturing process • Ability to complete assignments with minimum supervision

Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---MTB-Taiwan/WAREHOUSE-PROFESSIONAL_JR44915 職務說明 Ensure Timely and Accurate Receipts of both Incoming Inventory Shipments and Non-Inventory Shipments Stock, Maintain, and Deliver Warehouse Inventory Administer Inventory Control Functions Prepare and Ensure Timely Deliveries of Identified Shipments to Internal and External Customers Lead and/or Participate in Area Projects and Improvement Efforts Provides assistance and information to other work groups Promote a Safe Working Environment

Please apply on https://careers.micron.com/careers/job/19297267-chemical-engineer-global-facilities-construction-north-asia-taichung-city-taichung-city-taiwan?domain=micron.com As the Chemical Engineer for the Global Facilities & Construction North Asia Regional Department at Micron Technology, you will be responsible to provide high quality Engineering services and support for the planning, design, construction, operation, and maintenance of our subject area specific Facilities systems in support of the Semiconductor Manufacturing sites across the Micron Manufacturing Network in North Asia region (China, Taiwan and Japan) – for Chemical systems including slurry systems! In this role, we support the Facilities Teams and Manufacturing sites across the North Asia sites as the Technical Subject Matter Expert through all phases of design, construction, installation, start-up, operations and maintenance with focus and emphasis on Global Standardization and Alignment, Innovation, Reliability and Performance, and Sustainability! 【Provide Technical Support, Leadership, and Expertise】 • Provide consultation and support to Site Facilities & Manufacturing teams in North Asia region • Collaborate with internal partners and stakeholders including Technology Development Team, Procurement, Finance, Legal, etc. • Responsible for Micron system, equipment, and component Standards, Specifications, and Best Known Methods (BKMs) • Align standards across the Micron North Asia Network and Sites for Engineering and Design concepts, Construction Project execution, Reliability Programs deployment, and operations practices • Analyze system designs to identify improvements that will result in better performance, efficiency gains, reduced maintenance, and cost savings • Support sites with problem analysis using standard tools and methodologies as requested • Benchmark within and external to Micron sites on Engineering Best Practices and BKM of Facilities buildings and systems • Maintain leading technical knowledge on your respective area including for Industry Trends and Technological advances, emerging technology roadmap, Design Innovations, Sustainability, etc.) 【Provide Design and Construction Project Support, Leadership, and Expertise】 • Support new large-scale, Facilities Infrastructure Expansion projects • Develop the system design concepts and standards to be deployed into the Design and Construction Projects • Ensure appropriate communication with local Facilities, Design, Construction, Procurement and Manufacturing partners as required to deliver project objectives • Perform timely review of design packages and providing documented comments and feedback as vital • Provide support for cost and schedule estimates and justification for approval • Supervise and coordinate consultant resources • Ensure that scope meets customer needs and lead changes • Monitor progress and provide Engineering and Design support during construction as required per project if vital • Review capacity plan and system operating trends and validate utilization and diversity factor assumptions • Participate and/or lead capacity and scenario planning, including evaluation of system and distribution capacity impacts based on scenario • Review and advise on scope, schedule, and cost estimates for Facilities infrastructure additions or modifications 【Demonstrate EHS ownership】 • Follow all safety and environmental procedures to ensure compliance • Demonstrate awareness of local permit policies, codes, and regulations and deploy them to the Chemical team • Be an active participant in the EHS program by reporting all EHS-related concerns or problems immediately to the appropriate individual (ERT, Supervision, etc.)